Photoresist cutter head
A technology of cutter head and photoresist, which is applied in the direction of photoplate making process coating equipment, etc., can solve the problem of uneven coating film thickness and achieve uniform coating effect
Pending Publication Date: 2019-07-05
FUJIAN HUAJIACAI CO LTD
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Problems solved by technology
[0004] For this reason, it is necessary to provide a photoresist cutter head to solve the problem that the thickness of the coating film is prone to vary in the existing coating process
Method used
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[0024] In order to explain in detail the technical content, structural features, achieved goals and effects of the technical solution, the following will be described in detail in conjunction with specific embodiments and accompanying drawings.
[0025] see figure 1 , figure 2 , image 3 and Figure 4 , the present embodiment provides a photoresist cutter head, including a cutter head body 10, a buffer chamber 20 and a controller 30; the model of the controller is a Mitsubishi Q series Q01UCPU controller, the cutter head body is a hollow structure 101, and the buffer chamber is arranged on Inside the hollow structure of the cutter head body. In this embodiment, the pressure regulating device 21 is used to adjust the pressure of various parts in the buffer chamber, so that the photoresist liquid delivered from the liquid outlet 11 is relatively stable, and the liquid output of the cutter head body during coating is coordinated and controlled. Effectively improve the film t...
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The invention discloses a photoresist cutter head, comprising a cutter head body, a buffer chamber and a controller. The buffer chamber is provided with a pressure regulating device and a liquid outlet. The pressure regulating device comprises an adjustment branch pipe, pressure detectors and a bidirectional liquid pump. The buffer chamber is installed in the hollow structure of the cutter head body. The buffer chamber and the cutter head body share one side wall. The liquid outlet is disposed on the shared side wall, and the pressure detectors are is installed on the shared side wall at equalintervals in order to conveniently detect pressure at different parts in the buffer chamber. If a pressure value detected on a certain part is excessively high or low, the photoresist liquid is pumped by the bidirectional liquid pump and transferred to the buffer chamber at the part through the adjustment branch pipe, so that the pressure values at the respective parts of the buffer chamber are maintained within a certain range which can be set manually. Therefore, at the time of coating, the photoresist liquid supplied through the liquid outlet on the buffer chamber is relatively stable, thereby achieving a uniform coating effect.
Description
technical field [0001] The invention relates to the field of photoresist coating equipment, in particular to a photoresist cutter head. Background technique [0002] Optical film and the existing protective film or tape are two completely different concepts. For optical film, the thickness must be uniform, and the surface is required to be dust-free and less crystal points. However, there are higher requirements for its coating technology, for example, the film thickness is required to be more uniform, so that the coating needs to have a precise coating process, and it is continuously developed and improved, and then the tight coating is achieved. The production demand of cloth technology. [0003] In the conventional coating process, due to the uneven pressure of the coated chemical solution, the uniformity of the film thickness after coating is often too large, which directly affects the coating quality. As a result, different film thicknesses appear on the subsequent gl...
Claims
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IPC IPC(8): G03F7/16
CPCG03F7/16
Inventor 不公告发明人
Owner FUJIAN HUAJIACAI CO LTD