Strain gauge preparation method and strain gauge and Hopkinson bar having same

Abstract

A method for preparing a strain gauge and a strain gauge having the same, the method comprising the steps of: printing a strain-sensitive layer on a target surface; curing the strain-sensitive layer; arranging conductive components at the end of the strain-sensitive layer; A polymer film layer is disposed on the sensitive layer, so that the polymer film layer covers the connection point between the strain-sensitive layer and the conductive component and the strain-sensitive layer. This preparation method is suitable for the preparation of various target surfaces such as flat and curved surfaces, and can reduce the time for preparing strain gauges on the target surface and improve the production efficiency. At the same time, the strain gauges can be accurately prepared at the target position and bonded firmly to ensure that the The overall performance of the prepared strain gauge is stable and the sensitivity is high, and no air bubbles will appear in the preparation process, and the preparation process is clean and tidy.

Description

technical field [0001] The invention relates to the field of strain gauges, in particular to a preparation method of strain gauges, a strain gauge and a Hopkinson bar with the same. Background technique [0002] Strain gauges are commonly used measuring devices. The strain gauges currently used generally include resistance strain gauges and semiconductor strain gauges. Whether it is resistance strain gauges or semiconductor strain gauges, the functional layer is first fabricated on an insulating substrate. Large, the strain gauge needs to be pasted on the structure or the surface of the test piece when used. The bonding method is mainly glue bonding. When the adhesive is 502 glue, after the cleaning agent evaporates, first drop a little 502 glue on the patch position, spread the glue evenly with the back of the strain gauge, and then use tweezers to move the strain gauge , Adjust the position and angle. After the position is completed, put a layer of polyethylene or tetrafl...

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Problems solved by technology

In the process of realizing the present invention, the inventor found that there are at least the following problems in the prior art: the angle of the strain gauge is not easy to control: for the resistance strain gauge or the semiconductor strain gauge, it is directional, and for the commonly used grid shape The strain gauge has the largest deformation in the length direction, which means it is the most sensitive, and the width direction has the lowest sensitivity. Therefore, only by keeping the strain gauge parallel to the deformation direction of the specimen can the performance of the resistance strain gauge be improved, thereby improving the accuracy of measurement. , while the manual patch is difficult to ensure that the square of the resistance wire is parallel to the deformation direction of the material; the thickness of the adhesive is not easy to control: the deformation of the strain gauge is caused by the test piece, and if the thickness of the adhesive is too thick, it is easy to cause Deformation attenuation, too thin will easily lead to weak bonding. When applying the adhesive, you need to squeeze out the glue by hand, and ensure that there are no air bubbles on the contact surface. Press your fingers until the adhesive is cured. This process is related to bonding. The dose is related to the temperature, and it should be kept for at least a few minutes. During the pressing process, the fingers are easy to move and cause the direction of the strain gauge to be misaligned; the curing time is long: the adhesive after the initial curing needs to be left for a period of time to reach the maximum bonding strength; When the contact surface is flat, the bonding will be easier. When the contact surface is a curved surface, the contact surface between the substrate and the test piece is easy to warp, resulting in insufficient bonding between the functional layer and the test piece.

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