Parallel single-ground-wire ultrasoft wire

Abstract

The invention discloses a parallel single-ground-wire ultrasoft wire which comprises a core unit, a core wire assembly and an external protection assembly; the core unit comprises two first core pairsand two filling ropes, the two first core pairs are arranged in parallel, the two first core pairs are arranged in the two sides of the two first core pairs respectively, and the two first core pairsand two filling ropes are enclosed into a circle; the core wire assembly comprises second core pairs, each second core pair is wound around the core unit, and the outer wall of each second core pairis tightly fit to the outer wall of the core unit; and the external protection assembly comprises a shielding tape and an external tape, the shielding tape horizontally wraps the core wire assembly, and the external tape is spirally wound around the shielding tape. Thus, the insert loss performance and reflection loss performance can be improved, the wire feels softer, and the structure is more compact and more stable.

Description

technical field [0001] The invention relates to the field of wire structures, in particular to an ultra-soft parallel single ground wire. Background technique [0002] In order to meet the frequency band up to 25Ghz in the existing high-speed parallel lines, there will be no insertion attenuation and return loss signal peaks. At the same time, in order to eliminate the resonance effect, it is necessary to make the core wire and the shielding better, and the loss of each process is less , the traditional process is to enhance the skin-adherence by reducing the lay length of the dielectric film and increasing the tension of the coating film, and fasten the wire by layering the coating and using PET to reduce the looseness of the inner core wire of the wire pair. However, this process cannot meet the stability of insertion loss and reflection loss above 155GHz, and has a great impact on the processing (pin warping) and softness of the finished line. Contents of the invention ...

AI Technical Summary

Problems solved by technology

However, this process cannot meet the stability of insertion loss and reflection loss above 155GHz, and has a great impact on the processing (pin warping) and softness of the finished line.

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