Base material surface treatment method, casing, camera module and electronic equipment
A processing method and technology for the surface of the substrate, which are applied in the direction of electrical equipment shells/cabinets/drawers, TVs, electrical components, etc., can solve the problems of inability to meet the surface appearance requirements, and achieve the effect of meeting the surface appearance requirements and improving the appearance expression.
Active Publication Date: 2019-08-02
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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Problems solved by technology
[0003] The main technical problem to be solved by this application is that the existing technology cannot meet the user's requirements for the surface appearance of electronic equipment. Therefore, this application provides a substrate surface treatment method, a casing, a camera module and electronic equipment. The casing of this application The L value corresponding to the target area of the surface in the Lab color model is reduced to 5-15, which meets the user's requirements for the surface appearance of electronic equipment
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[0025] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only part of the embodiments of the application, not all of them. Based on the implementations in this application, all other implementations obtained by persons of ordinary skill in the art without making creative efforts belong to the protection of this application.
[0026] refer to figure 1 , figure 1 It is a schematic flow chart of the first embodiment of the substrate surface treatment method of the present application. The application provides a substrate surface treatment method, the substrate surface treatment method comprises the following steps:
[0027] S11: Provide a substrate.
[0028] The base material includes an outer surface, and a through hole penetrating the outer surface is opened on the base material, and a target area is ar...
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Abstract
The invention relates to the technical field of electronic equipment and particularly discloses a casing. The casing includes a base material and an anti-reflection layer, wherein the base material isprovided with a through hole for penetrating through an outer surface, periphery of the through hole is provided with a target region, a corresponding L value of the target region in a Lab color model is 20-30, the reflection layer is arranged in the target region of the base material, and a corresponding L value of the target region provided with the anti-reflection layer in the Lab color modelis 5-15. The casing is advantaged in that the corresponding L value of the target region at the surface in the Lab color model is reduced to be 5-15, and surface appearance requirements of a user forthe electronic equipment are met.
Description
technical field [0001] The present application relates to the technical field of electronic equipment, in particular to a substrate surface treatment method, a casing, a camera module and electronic equipment. Background technique [0002] With the advancement of mobile terminal technology, electronic devices such as mobile phones, PDAs (personal digital assistants, personal digital assistants), and digital photo frames are more and more widely used. With the increasing requirements for the surface appearance of electronic equipment, the surface treatment method of the electronic equipment housing has received extensive attention, but the color pattern formed by the spraying process cannot meet the user's requirements for the surface appearance of electronic equipment. Contents of the invention [0003] The main technical problem to be solved by this application is that the existing technology cannot meet the user's requirements for the surface appearance of electronic equ...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K5/02H04N5/225
CPCH05K5/0243H04N23/50H04N23/51H04N23/57
Inventor 蒋正南杨光明
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD