Coaxial-interconnect structure for a semiconductor component

Abstract

The present disclosure describes a coaxial-interconnect structure that is integrated into a semiconductor component and methods of forming the coaxial-interconnect structure. The coaxial interconnect-structure, which electrically couples circuitry of an integrated-circuit (IC) die to traces of a packaging substrate, comprises a signal core elongated about an axis, a ground shield elongated about the axis, and an insulator disposed between the signal core and the ground shield.

Description

[0001] Cross References to Related Applications [0002] This disclosure claims priority to U.S. Provisional Patent Application No. 62 / 623,416, filed January 29, 2018, the entire disclosure of which is incorporated herein by reference. technical field [0003] The present disclosure relates to coaxial interconnect structures for semiconductor components. Background technique [0004] The background description provided herein is for the purpose of generally presenting the environment in which the disclosure will apply. Unless otherwise indicated herein, the approaches described in this section are not prior art to the claims in the present disclosure and are not admitted to be prior art by inclusion in this section. [0005] In the wireless networking industry, semiconductor components operate at high-speed frequencies exceeding, for example, 2.4 gigahertz (GHz). To accommodate such high-speed frequencies and improve the signal performance of semiconductor components, pac...

AI Technical Summary

Problems solved by technology

Contrary to efforts associated with incorporating ground planes or ground traces in portions of semiconductor components, the exposed nature of interconnect structures can lead to signal degradation due to signal loss or signal interference

Images