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Method for preventing PCB from being scrapped due to hole blocking by printing ink

A technology of plugging holes and ink, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuits, etc., can solve problems such as ink plugging holes and failure to meet customer acceptance requirements, and achieve the effect of avoiding direct scrapping

Pending Publication Date: 2019-08-30
奥士康精密电路(惠州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the present invention aims at the FQC inspection of PCB products before shipment and finds that there is some ink plugging in the VIA double-sided window holes, which cannot meet the customer’s acceptance requirements and needs to be scrapped or further processed. After confirmation, such apertures must ensure transparency. To solve the technical problems of light and brightness, the present invention provides a method for preventing ink from clogging PCBs and scrapping them

Method used

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  • Method for preventing PCB from being scrapped due to hole blocking by printing ink
  • Method for preventing PCB from being scrapped due to hole blocking by printing ink
  • Method for preventing PCB from being scrapped due to hole blocking by printing ink

Examples

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Effect test

Embodiment 1

[0021] A kind of method that prevents printing ink from clogging the PCB and scrapping, it is characterized in that, comprising the following specific steps:

[0022] S1. Confirm the hole diameter D of VIA hole 1 with PTH double-sided window opening, and obtain the diameter size d of the re-drilled VIA drill tip, d=D-0.2mm; it can avoid damage to the copper layer in the hole.

[0023] S2. Finished SET size positioning hole selection: select ≥ 3 NPTH positioning holes 2 from around the SET;

[0024] S3. Each axis is designed according to the size of SET; it can ensure the efficiency of back drilling.

[0025] Further, the dimensions of the finished SET and the positions of the positioning holes are designed symmetrically.

[0026] Further, a fool-proof point 3 is set on the side of the finished SET. Since the size of the SET finished product and the position of the positioning hole are designed symmetrically, after the positioning hole is confirmed, the SET board can be snapp...

Embodiment 2

[0030] A kind of method that prevents printing ink from clogging the PCB and scrapping, it is characterized in that, comprising the following specific steps:

[0031] S1. Confirm the hole diameter D of VIA hole 1 with PTH double-sided window opening, and obtain the diameter size d of the re-drilled VIA drill tip, d=D-0.2mm; it can avoid damage to the copper layer in the hole.

[0032] S2. Finished SET size positioning hole selection: select ≥ 3 NPTH positioning holes 2 from around the SET;

[0033] S3. Each axis is designed according to the size of SET; it can ensure the efficiency of back drilling.

[0034] Further, the dimensions of the finished SET and the positions of the positioning holes are designed symmetrically.

[0035] Furthermore, two fool-proof points 3 are set on one side of the finished SET. Since the size of the SET finished product and the position of the positioning hole are designed symmetrically, after the positioning hole is confirmed, the SET board can ...

Embodiment 3

[0039] A kind of method that prevents printing ink from clogging the PCB and scrapping, it is characterized in that, comprising the following specific steps:

[0040] S1. Confirm the diameter D of the VIA hole with double-sided windows on the PTH, and obtain the diameter d of the VIA drill tip for re-drilling, d=D-0.2mm; it can avoid damage to the copper layer in the hole.

[0041] S2. Finished SET size positioning hole selection: select ≥ 3 NPTH positioning holes from around the SET;

[0042] S3. Each axis is designed according to the size of SET; it can ensure the efficiency of back drilling.

[0043] Further, the dimensions of the finished SET and the positions of the positioning holes are designed symmetrically.

[0044] Further, set 2 fool-proof points on one side of the finished SET. Since the size of the SET finished product and the position of the positioning hole are designed symmetrically, after the positioning hole is confirmed, the SET board can be snapped in in ...

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Abstract

The invention provides a method for preventing a PCB (Printed Circuit Board) from being scrapped due to hole blocking by printing ink. The method is characterized by comprising the following specificsteps: S1, confirming the aperture size D of a PTH double-sided windowing VIA hole, and obtaining the diameter size d of a drill bit of a return drilling VIA drill, wherein d=D-0.2mm; S2, selecting asize positioning hole of a finished SET: selecting three or more than three NPTH positioning holes from the periphery of the SET; and S3, performing typesetting design on each axis according to the size of the SET. According to the invention, through the design of the printing ink hole blocking SET redrilling method, the PCB from being directly scrapped due to hole blocking by printing ink; drilling and redrilling are performed on part of the VIA holes blocked by the printing ink to obtain a fool-proof method in the redrilling process; and a set of printing ink hole blocking SET redrilling andfool-proof method is obtained, and the customer quality is met.

Description

technical field [0001] The invention relates to the technical field of PCB processing, in particular to a method for preventing ink from blocking holes and scrapping PCBs. Background technique [0002] With the technological innovation of electronic products, high-end technical products continue to emerge, and various product requirements and specifications have brought certain impacts on the PCB production process. In the process of PCB design and control, high-precision requirements need to be met, which brings us a test. Many electronic products are developing in the direction of high precision, high integration, and high performance; among them, the VIA hole is generally made of aluminum Chip plug hole method, but there will be many through holes with double-sided windows in the customer's design. It is required that the aperture of the finished product is completely through the window, and there is no ink residue. And if the development is not rinsed clean, there wil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0047
Inventor 邓万权贺波蒋善刚
Owner 奥士康精密电路(惠州)有限公司