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Method and device for assembling backlight module and electronic equipment

A technology for backlight modules and assembly components, which is used in identification devices, electrical digital data processing, computer-aided design, etc., can solve the problems of poor picture quality of backlight modules, lower investment income ratio, and cumbersome process, and reduce frequent shutdowns. risk, improve the return on investment ratio, and avoid adverse effects

Active Publication Date: 2019-09-17
BOE TECH GRP CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention provides a method, device and electronic equipment for assembling a backlight module to solve the problem that when assembling with the same offset value in the prior art, the picture quality of the backlight module may be poor due to deviation, which may cause frequent shutdowns of the assembly equipment. It is necessary to assemble the equipment to analyze the cause of the failure and adjust the offset value. The process is relatively cumbersome, resulting in a decrease in the return on investment ratio, which in turn leads to a decrease in production capacity.

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  • Method and device for assembling backlight module and electronic equipment
  • Method and device for assembling backlight module and electronic equipment
  • Method and device for assembling backlight module and electronic equipment

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Embodiment Construction

[0065] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used in the embodiments of the present invention and the appended claims, the singular forms "a", "said" and "the" are also intended to include the plural forms unless the context clearly indicates otherwise.

[0066] It should be understood that although the terms first, second, etc. may be used in the embodiments of the present invention to describe the position matrix, assembly position and picture quality, these position matrix, assembly position and picture quality should not be limited to these terms. These terms are only used to distinguish data volumes fro...

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Abstract

The invention provides a method and device for assembling a backlight module and electronic equipment. The method comprises: acquiring the target size of a to-be-assembled device and the initial assembly position of a to-be-assembled component; inputting the target size and the initial assembly position into an assembly model obtained in advance, and obtaining a position offset value of the to-be-assembled device output by the assembly model, wherein the assembly model is obtained by training the picture quality of the backlight module according to a plurality of pieces of position information of the to-be-assembled device and different pieces of position information of the to-be-assembled device; and adjusting the position of the device to be assembled according to the position deviation value, and carrying out assembling. According to the invention, the poor picture quality of the backlight module can be avoided, the risk of frequent shutdown of assembly equipment is reduced, the investment income ratio is further improved, and the productivity of the backlight module is improved.

Description

technical field [0001] The invention relates to the field of assembling backlight modules, in particular to a method, device and electronic equipment for assembling a backlight module. Background technique [0002] At present, the assembly equipment of the backlight module is usually: after collecting the size and position information of each component of the backlight module through a visual camera, input the offset value of each component on the assembly equipment, and the assembly offset value with the best picture quality can be obtained . [0003] However, due to the many different sizes of each device, when the assembly space is small, when assembling with the same offset value, the picture quality of the backlight module will be poor due to the deviation (white lines / black lines / light leakage at the edge, light-facing parts Or the white line / black line / light leakage / Hot spot of the incident part). When the backlight module is defective, it may lead to frequent shutd...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50G09F9/00
CPCG09F9/00G06F2113/20G06F30/20Y02P90/30
Inventor 权宁万全英镐熊彦楠孙海威桑建
Owner BOE TECH GRP CO LTD