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Binding method of display device and driver chip

A technology for display devices and driver chips, which can be applied to semiconductor/solid-state device components, semiconductor devices, electrical components, etc., and can solve the problems of high R&D costs

Active Publication Date: 2021-01-29
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to prevent a part of the binding portion 120 from being peeled off from the flexible substrate 110, the usual method is to improve the composition of the conductive adhesive used to make the conductive adhesive 300, but the cost of research and development is high.

Method used

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  • Binding method of display device and driver chip
  • Binding method of display device and driver chip
  • Binding method of display device and driver chip

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Embodiment Construction

[0041] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0042] After repeated research by the inventors of the present invention, it has been found that one of the main reasons for the insufficient binding strength between the driver chip and the display panel is that the part where the binding part is in contact with the flexible substrate is mostly made of inorganic materials, and inorganic materials often pass through the gas phase. The deposition method is formed on a flexible substrate made of organic materials, and the bonding strength between inorganic materials and organic materials is low.

[0043] In view of this, as an aspect of the present invention, a display device is provided, such as figure 2 and ...

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Abstract

The present invention provides a display device. The display device includes a flexible display panel and a driver chip disposed on the flexible display panel. The flexible display panel includes a flexible substrate and a driver chip formed on the flexible substrate. A binding part on one side, the driver chip is attached to the binding part, the binding part is provided with at least one connection hole passing through the binding part along the thickness direction, and the display device also includes a conductive adhesive layer made of conductive glue, the conductive adhesive layer is bonded between the driver chip and the binding part, a part of the conductive adhesive layer is filled in the connection hole, and The part of the conductive adhesive layer located in the connection hole is adhered between the flexible substrate and the driving chip. The cost of the display device is low, and the driving chip is not only firmly combined with the binding part, but also the binding part is not easy to peel off from the flexible substrate. The invention also provides a binding method of the driving chip.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display device and a method for binding a driving chip in the display device. Background technique [0002] The display device includes a display panel and a driver chip that provides driving signals for the display panel. Usually, a binding part is provided in the binding area of ​​the display panel, and the driver chip is bonded to the binding part to realize the binding of the driver chip. [0003] According to different substrates used, display devices can be classified into two types: flexible display devices and rigid display devices. [0004] figure 1 Shown in is a cross-sectional view of the flexible display device in the binding area, as shown in the figure, the flexible substrate 110 is provided with a binding part 120, and the driving chip 200 is bound to the binding part 120 through a conductive adhesive layer 300 . [0005] However, in the flexible disp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L21/60
CPCH01L24/32H01L24/83H01L2224/32057H01L2224/32146H01L2224/83024
Inventor 石领陈立强
Owner BOE TECH GRP CO LTD