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FPC and TFT binding method and display module

A display module and binding technology, applied in the direction of assembling printed circuits, electrical components, circuits, etc. with electrical components, can solve the problems of poor binding firmness of FPC and TFT, reduce internal contamination of pad printing, enhance adhesion, Avoid failure or shedding effects

Pending Publication Date: 2021-12-24
TRULY SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The invention discloses a binding method of FPC and TFT and a display module, which are used to solve the problem of poor binding firmness of FPC and TFT in the prior art

Method used

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  • FPC and TFT binding method and display module
  • FPC and TFT binding method and display module

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Embodiment Construction

[0029] In order to make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] The binding method of FPC2 and TFT1 of the present invention, such as figure 1 , figure 2 shown, including steps:

[0031] Step S10, mixing a set amount of organosilane in the ACF to form a bonding glue 3;

[0032] Step S20, using a glue dispenser to apply glue 3 on the bonding part of the FPC2;

[0033] Step S30, using a binding device to bind FPC2 and TFT...

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Abstract

The invention discloses an FPC and TFT binding method and a display module. The method comprises the steps of mixing a set amount of organosilane in an ACF to form a bonding adhesive; dispensing the bonding adhesive on the bonding part of the FPC by using a dispensing machine; binding the FPC and the TFT by using binding equipment, wherein a substrate, which is used for binding the FPC, of the TFT is a glass substrate; and curing the bonding adhesive between the FPC and the TFT by using a curing machine. According to the invention, after the organosilane is mixed in the ACF, the organosilane reacts with the ACF to generate a silanol group, and the silanol group can form a strong ether bond with a silanol group on the glass surface, so that the adhesive force when the FPC is bound with the TFT is enhanced, and the reliability of the TFT is greatly improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for binding FPC and TFT and a display module. Background technique [0002] Although the TFT-LCD industry is a very mature industry, there are more or less difficulties due to the limitations of the process and design defects. For example, the glue used when binding FPC and TFT is ACF, and ACF realizes the fixation and electrical conduction of FPC and TFT. [0003] However, the poor viscosity of ACF makes the FPC easy to loosen and even fall off from the TFT. This will cause a series of problems, such as pad printing internal pollution, Cgd, parasitic capacitance, via corrosion, electrostatic damage, flicker, binding failure or afterimage, etc., which will affect the performance and life of TFT-LCD and reduce user experience. . Contents of the invention [0004] The invention discloses a binding method of FPC and TFT and a display module, which are used to solve th...

Claims

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Application Information

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IPC IPC(8): H05K3/32H01L23/00H01L23/498
CPCH05K3/321H01L24/11H01L24/81H01L23/49816H01L2224/111H01L2224/812
Inventor 陈致临
Owner TRULY SEMICON