FPC and TFT binding method and display module
A display module and binding technology, applied in the direction of assembling printed circuits, electrical components, circuits, etc. with electrical components, can solve the problems of poor binding firmness of FPC and TFT, reduce internal contamination of pad printing, enhance adhesion, Avoid failure or shedding effects
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[0029] In order to make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0030] The binding method of FPC2 and TFT1 of the present invention, such as figure 1 , figure 2 shown, including steps:
[0031] Step S10, mixing a set amount of organosilane in the ACF to form a bonding glue 3;
[0032] Step S20, using a glue dispenser to apply glue 3 on the bonding part of the FPC2;
[0033] Step S30, using a binding device to bind FPC2 and TFT...
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