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Display substrate, display panel and display device

A display substrate and display area technology, which is applied in the direction of instruments, nonlinear optics, optics, etc., can solve the problem of bonding failure between the chip-on-chip flexible circuit board and the display panel, so as to avoid binding failure, suppress diffusion, and prevent diffusion to the effect on the pad

Active Publication Date: 2020-09-25
XIAMEN TIANMA MICRO ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to ensure the binding impedance of the chip-on-film flexible circuit board and the display panel, the width of the binding area should be greater than 1.1mm, so the distance between the bonding area pad and the display area is less than 1.4mm; When the film is formed, the diffusion area of ​​the alignment liquid is greater than 1.5mm, and there is a situation where the alignment liquid diffuses to the pad, which will lead to the failure of the bonding between the chip-on-chip flexible circuit board and the display panel

Method used

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  • Display substrate, display panel and display device
  • Display substrate, display panel and display device
  • Display substrate, display panel and display device

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Embodiment Construction

[0039] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.

[0040] In the production process of liquid crystal display devices, the orientation control technology of liquid crystal molecules is very important. At present, an orientation film is usually coated on the surface of the array substrate and color filter substrate near the liquid crystal layer to realize the orientation control of liquid crystal molecules. When realizing the design of a display panel with a narrower lower frame, in order to prevent the alignment liquid from diffusing to the bonding pads bound to th...

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Abstract

An embodiment of the invention discloses a display substrate, a display panel and a display device, wherein the display substrate includes a display area and a non-display area; the non-display area is provided with a plurality of pads for binding a chip-on-film flexible circuit board; the non-display area is also provided with at least one first trench; at least part of each pad lose to the non-display area is positioned in an area enclosed by the first trenches. The display substrate, the display panel and the display device according to the embodiment have the advantages that an orienting liquid is avoided diffusing to the pads bound to the chip-on-film flexible circuit board and binding failure of the chip-on-film flexible circuit board with the display panel is avoided.

Description

technical field [0001] Embodiments of the present invention relate to display technologies, and in particular to a display substrate, a display panel and a display device. Background technique [0002] With the wide application of display devices (such as mobile phones), full screen or high screen-to-body ratio has become an important technical index for measuring display devices. Therefore, the technology of realizing narrow borders under the display panel is becoming more and more important. [0003] Chip On Flex (COF) technology, that is, to fix the driver IC on the flexible circuit board and the grain soft film construction technology, is to use the soft additional circuit board as the chip carrier to package the chip, and connect the chip to the flexible substrate circuit Technology, can realize the lower narrow frame design with a width of 2.5mm, and the flexible circuit board with driver IC packaged with COF technology can be called chip-on-film flexible circuit board...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/1345
CPCG02F1/1345G02F1/13458
Inventor 夏丹李作银文亮陈国照
Owner XIAMEN TIANMA MICRO ELECTRONICS