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Copper fine particle, method for producing same, and sintered body

一种制造方法、铜微粒的技术，应用在运输和包装、金属加工设备等方向，能够解决铜微粒氧浓度上升、分散性下降、铜微粒凝聚性提高等问题，达到实现成本下降的效果

Active Publication Date: 2019-09-20
NIPPON SANSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, since the sintering temperature of copper fine particles is high, for example, when applying conductive ink and conductive paste containing copper fine particles to printed circuit boards with resin substrates, etc., resin materials with low heat resistance such as PET films cannot be used.
Therefore, when using conductive ink or conductive paste containing copper particles, for example, there is a problem that it is necessary to use a material with high heat resistance such as polyamide for the resin substrate, which is a major cause of cost increase.
However, when the particle size of the copper particles is reduced, the oxygen concentration in the copper particles may increase due to the increase in the specific surface area, and the reduction may take time, resulting in a decrease in productivity.
In addition, when the particle size of the copper particles is controlled to be small, there are also problems such as the increase of the cohesion of the copper particles and the decrease of the dispersibility.

Method used

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  • Copper fine particle, method for producing same, and sintered body
  • Copper fine particle, method for producing same, and sintered body
  • Copper fine particle, method for producing same, and sintered body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～11

[0120] In Examples 1-11, use such as figure 1 Shown manufacturing apparatus 50 (comprising figure 2 , 3 In the shown burner 3), under the conditions shown in Table 1 and Table 2 below, copper fine particles P were produced in the procedure described below.

[0121] In Examples 1 to 11, propane having a carbon content shown in Table 2 below was used as the fuel gas G1 supplied to the burner 3 . Specifically, in Examples 1 to 11, as the fuel gas G1, any of methane, propane, or a mixed gas of methane and hydrogen (methane+50% hydrogen or methane+75% hydrogen) is used as a combustible gas. In this way, the amount of carbon in the fuel gas G1 is adjusted according to changes in the composition. For example, the above-mentioned methane + 50% hydrogen or methane + 75% hydrogen used as fuel gas G1 means that 50% or 75% of methane is mixed with 100% of methane on the basis of low calorific value (see Table 1 below). Hydrogen is a mixed fuel of methane and hydrogen.

[0122] In ad...

Embodiment 12～16

[0148] In Examples 12-16, use figure 1 The manufacturing apparatus 50 shown produced the copper fine particle P by the procedure similar to Example 1 etc. under the conditions shown in following Table 3. Furthermore, in Examples 12 to 16, the recovered copper fine particles P (exhaust gas D) were supplied to post-treatment using a batch-type heat treatment apparatus (post-heat treatment unit) using a heater not shown in the figure as a separate facility. Inert gas (illustration omitted) and post-heat treatment (post-treatment process) were performed, and the copper fine particles P were produced under conditions and procedures different from those of Examples 1-11.

[0149] Specifically, in Examples 12 to 16, using the manufacturing apparatus 50, copper fine particles P were produced under the same conditions as in the above-mentioned Examples 1 to 5, and the fine particles were post-treated in the inert gas in the processing furnace of the post-heating treatment section. Hea...

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Abstract

The purpose of the present invention is to provide: a copper fine particle which can be sintered at a lower temperature than the prior art without an increase in cost or a reduction in productivity and the like; a method for producing the copper fine particle; and a sintered body. The present invention provides a copper fine particle characterized by having on the surface thereof, a coating which contains a cuprous oxide and a copper carbonate.

Description

technical field [0001] The present invention relates to copper particles, a method for producing the same, and a sintered body. Background technique [0002] In recent years, for example, technical innovations such as high-density wiring have become remarkable along with the performance enhancement, miniaturization, and weight reduction of electronic devices and printed circuit boards used in electronic component devices. Examples of materials for forming such high-density wiring include conductive inks and conductive pastes, and these materials contain silver particles to impart conductivity. However, silver has problems such as high cost and easy migration. Therefore, the use of low-cost copper fine particles having the same conductivity as silver instead of silver fine particles has been studied. [0003] However, since the sintering temperature of copper fine particles is high, for example, when applying conductive ink and conductive paste containing copper fine partic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02B22F1/00B22F9/12B22F9/28B22F1/054B22F1/065B22F1/142B22F1/16
CPCB22F9/28B22F9/12B22F9/22B22F2998/10B22F1/054B22F1/142B22F1/16B22F1/056C22C1/04B22F2301/10B22F2302/25
Inventor 樱本裕二五十岚弘藤本隆之
Owner NIPPON SANSO CORP