Connector Plating Process

An electroplating process and connector technology, which is applied in the field of connector electroplating technology, can solve problems such as impedance and solder functional hazards, short circuits, etc., and achieve good degreasing effect, flat coating, flat and dense crystal lattice.

Active Publication Date: 2020-11-27
惠州锦鑫表面处理有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The conventional electroplating process solution is to use a sealing agent after electroplating, and the sealing agent is an organic substance, which has hidden dangers to the function of impedance and solder, and will have a serious impact on high-current connectors (such as USB interface and BATTERY) after carbonization impedance or risk of creating a short circuit

Method used

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Examples

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Embodiment approach 1

[0023] This embodiment provides a connector electroplating process, the flow of the process is as follows figure 1 As shown, first place the connector to be plated in the electroplating tank, and then degrease it. The process of degreasing is as follows:

[0024] Keep the temperature of the bath at 60°C, first perform ultrasonic degreasing on the connectors to be plated for 5-10 seconds, and then keep the current density at 12-18ASD (at this time, the temperature of the bath is still 60°C) and perform cathodic electrolytic degreasing on them (connectors to be plated Connect the plug-in to the cathode) for 10-20 seconds, and finally keep the current density at 12-18ASD (at this time, the temperature of the bath is still 60°C) for anodic electrolytic degreasing (the connector to be plated is connected to the anode) for 5-10 seconds; After two washes at room temperature, wash again in hot water at a temperature of 45-55°C.

[0025] After degreasing and water washing, carry out p...

Embodiment approach 2

[0035] This embodiment provides a connector electroplating process, the degreasing process is exactly the same as Embodiment 1; in the pickling activation process, after uniform mixing of 30% ammonium bifluoride and 70% sodium fluoride, the mixture is weighed to prepare 80 g / L Aqueous solution, energized voltage is 4V, all the other are identical with embodiment 1; In the nickel plating process, when nickel-phosphorus-tellurium multi-element alloy nickel is plated for the first time, the mass percentage of phosphorus wherein is 0.2%, the mass percentage of tellurium 0.2%, the second When nickel-phosphorus-tellurium multi-element alloy nickel is plated for the second time, the mass percentage of phosphorus and tellurium is 0.2% and 0.2% by mass.

Embodiment approach 3

[0037] This embodiment provides a connector electroplating process, the degreasing process is exactly the same as Embodiment 1; in the pickling activation process, after uniform mixing of 30% ammonium bifluoride and 70% sodium fluoride, the mixture is weighed to prepare 100 g / L Aqueous solution, energized voltage is 4V, all the other are identical with embodiment 1; In the nickel plating process, when nickel-phosphorus-tellurium multi-element alloy nickel is plated for the first time, the mass percentage of phosphorus wherein is 0.1%, the mass percentage of tellurium 0.1%, the second When nickel-phosphorus-tellurium multi-element alloy nickel is plated for the second time, the mass percentage of phosphorus and tellurium is 0.1% and 0.1% by mass.

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Abstract

The invention relates to the technical field of electronic connector electroplating, and discloses a connector electroplating process, comprising the following steps: degreasing: performing ultrasonicdegreasing, cathodic electrolytic degreasing and anodic electrolytic degreasing in sequence; water washing after degreasing; activation: performing anode electrolysis activation in a solid inorganicacid salt aqueous solution, and water washing after activation; nickel plating: plating nickel-phosphorus-tellurium multi-alloy nickel, plating semi-gloss nickel after water washing, and plating nickel-phosphorus-tellurium multi-alloy nickel again after water washing. Compared with the prior art, the process optimizes the pre-treatment, water washing and nickel plating processes, especially the design of the multi-alloy nickel layer, so that a coating is flat and has no pinhole under a 1000-fold microscope; the product can pass a salt spray test after electroplating without an organic sealingfilm, and has no quality issues such as impedance and soldering in use; after the connector is electroplated by the process, sodium chloride can be effectively prevented from entering the inside of the coating in the salt spray test, thus effectively avoiding corrosion of primary batteries.

Description

technical field [0001] The invention relates to the technical field of electronic connector electroplating, in particular to a connector electroplating process. Background technique [0002] The electroplating of connectors needs to be nickel-plated first to play the role of anti-corrosion base, and then gold, tin, etc. are plated on the nickel layer. In the past two years, the salt spray judgment standard of electronic connector coating has been continuously tightened, and the requirements for salt spray have become more stringent. From the early visual inspection, only the contact area is judged and the grade is judged according to the corrosion area, and then the overall product visual inspection in the later stage There is no corrosion, and the current judgment standard is that all products pass the salt spray test without any defects under a 40X microscope. The conventional electroplating process solution is to use a sealing agent after electroplating, and the sealing ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/34C25D3/56C25D3/12C25F1/04C25D5/48C25D5/14C25D7/00
CPCC25D3/12C25D3/562C25D5/14C25D5/34C25D5/48C25D7/00C25F1/04
Inventor 朱秀芳钱诚孙锋石莹莹
Owner 惠州锦鑫表面处理有限公司
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