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A multi-layer high temperature heat insulation component

A thermal insulation component, high temperature technology, applied in the direction of thermal insulation, building components, construction, etc., can solve the problems of unstable installation and complicated installation of high temperature thermal insulation panels, achieve good tensile effect, reduce cost investment, and reduce splicing gap effect

Active Publication Date: 2021-04-20
WUHAN DINGYE ENVIRONMENTAL PROTECTION ENG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] A multi-layer high temperature heat insulation assembly proposed by the present invention solves the problem that the installation of the existing high temperature heat insulation board is not stable enough and the installation is relatively complicated

Method used

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  • A multi-layer high temperature heat insulation component
  • A multi-layer high temperature heat insulation component
  • A multi-layer high temperature heat insulation component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0019] Embodiment: When in use, first align the mounting groove 14 at the bottom end of the second heat insulating board 2 with the rack plate 13 at the top of the first heat insulating board 1, and make the rack plate 13 slowly enter the inside of the mounting groove 14, thereby The tooth piece on the rack plate 13 is engaged with the tooth piece on the gear plate 12, so that the gear plate 12 rotates, and when the gear plate 12 rotates, the tooth piece on its circumferential side wall will engage with the tooth piece on the rack insertion rod 10. The tooth blocks are engaged, so that the rack inserting rod 10 slides in the movable groove 11, and the rack inserting rod 10 will drive the slider 8 to slide in the chute 9 until the rack inserting rod 10 is inserted into both sides of the rack plate 13 The inside of the socket 7 is sufficient, thus completing the splicing of the first heat insulation board 1 and the second heat insulation board 2, and then splicing the two heat in...

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Abstract

The invention discloses a multi-layer high-temperature heat insulation assembly, which relates to the field of heat insulation. Aiming at the problem that the installation of the existing high-temperature heat insulation board is not stable enough and the installation is relatively complicated, the following scheme is proposed, which includes a first heat insulation board, The second heat insulation board, the third heat insulation board and the fourth heat insulation board, the structures of the first heat insulation board, the second heat insulation board, the third heat insulation board and the fourth heat insulation board are the same, and the The top of the first heat insulation board is connected with a rack plate, the bottom end of the second heat insulation board is provided with a mounting groove, and the inside of the second heat insulation board is located on both sides of the installation groove and is provided with symmetrically arranged movable parts. groove. The invention can effectively splice and install the heat insulation board instead of the traditional bonding method, not only can reduce the splicing gap, but also can ensure the stability of the splicing installation, thereby improving the efficiency of heat insulation board installation and reducing cost input. The heat insulation board has good stretch resistance effect and is not easy to be damaged, which is beneficial to prolong the service life of the heat insulation board.

Description

technical field [0001] The invention relates to the field of heat insulation, in particular to a multilayer high-temperature heat insulation component. Background technique [0002] During the construction of multi-storey buildings, it is necessary to lay high-temperature insulation panels on the walls, while traditional high-temperature insulation panels are generally completed by bonding, and this installation method has large splicing gaps and insufficient installation Stability problems, therefore, in order to solve such problems, we propose a multi-layer high temperature insulation component. Contents of the invention [0003] A multi-layer high-temperature heat insulation component proposed by the invention solves the problem that the installation of the existing high-temperature heat insulation board is not stable enough and the installation is relatively complicated. [0004] In order to achieve the above object, the present invention adopts the following technica...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): E04B1/80E04B1/94E04B1/61
CPCE04B1/6125E04B1/6137E04B1/6141E04B1/80E04B1/942
Inventor 罗恪
Owner WUHAN DINGYE ENVIRONMENTAL PROTECTION ENG TECH CO LTD
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