Capacitive whiteboard touch film structure and touch signal processing method

Abstract

The invention discloses a capacitive whiteboard touch film structure and a touch signal processing method. The touch film structure comprises an insulating film. The insulating film is divided into atleast two insulating regions which are adjacent in sequence; one insulation area is set as a first insulation area, the same number of wires in the same direction are laid in each insulation area, the wires in the first insulation areas are connected to the PCB through outgoing lines, and the wires in the other insulation areas are sequentially connected with one wire in the first insulation areathrough overlines. The touch signal processing method comprises the following steps: receiving a touch signal; determining the position and size information of the touch point, judging the number andconcentration of the touch points of all the touch signals, setting a touch point threshold value, and removing the touch signals which do not meet the touch point threshold value; carrying out signal characteristic judgment on the rest touch signals, and eliminating the touch signals which do not meet the signal characteristics; carrying out signal suppression on the eliminated touch signal; andobtaining real touch point information.

Description

technical field [0001] The invention relates to the technical field of capacitive whiteboards, in particular to a touch film structure and a touch signal processing method of a capacitive whiteboard. Background technique [0002] The touch control structure of the capacitive whiteboard in the prior art is that a number of wires along the horizontal direction are arranged on one side of an insulating layer, and a number of wires along the vertical direction are arranged on the other side of the insulating layer. All wires need to be connected to the PCB board through lead wires, such as figure 1 As shown, this structure needs to lay dozens of PCB boards around the capacitive whiteboard, and connect the leads of the wires to the PCB board. Therefore, the processing technology of the touch structure is very complicated and the manufacturing cost is high. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a capacitive ...

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a capacitive whiteboard touch film structure and a touch signal processing method in view of the deficiencies of the prior art, so as to overcome the large number of capacitive whiteboard touch structures laid around the capacitive whiteboard in the prior art. PCB boards, resulting in complex processing of the touch structure and high manufacturing costs

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