Press machine having pressure equalizing device and pressure equalizing device

A technology of pressure equalizing device and pressing machine, which is applied in the manufacturing of multi-layer circuits, electrical components, and printed circuits, etc., can solve the problems of uneven pressure, affecting the quality of printed circuit boards, and uneven pressure.

Active Publication Date: 2019-11-01
冈崎静明
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the hydraulic cylinder 83 of the pressing machine 8, the cross-section of a driving rod 831 used to drive the pressing plate 82 to move is circular, while the pressing plate 82 is square, and the bottom area is larger than that of the driving rod 831. Therefore, when the hydraulic cylinder 83 pressurizes the press plate 82, the pressure around the press plate 82 will be less, and the pressure on the central part will be larger (see figure 2 ), resulting in uneven pressure on the multilayer printed circuit board 9. In addition, the base material and copper foil of today's printed circuit boards are becoming lighter and thinner, and this uneven pressure problem will more significantly affect the finished product. The quality of the printed circuit board

Method used

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  • Press machine having pressure equalizing device and pressure equalizing device
  • Press machine having pressure equalizing device and pressure equalizing device
  • Press machine having pressure equalizing device and pressure equalizing device

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no. 1 example

[0028] refer to image 3 , the first embodiment of the pressing machine with a pressure equalizing device in the present invention includes a frame 1 , a plurality of pressing plates 2 , a driving device 3 , and a pressure equalizing device 4 .

[0029] The pressing plates 2 are arranged on the frame 1 at intervals along a pressing direction D1. In this embodiment, the pressing direction D1 is substantially the up-and-down direction, and the uppermost pressing plate 2 is fixed on the frame 1, and the rest of the pressing plates 2 are set on the frame 1 so as to be movable along the pressing direction D1. . In this embodiment, the temperature of the pressing plates 2 can be raised and lowered to heat and cool the materials placed between the pressing plates 2 .

[0030] The driving device 3 is positioned relative to the frame 1 . In this embodiment, the driving device 3 is located below the pressing plate 2 along the pressurizing direction D1, and the driving device 3 has a ...

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Abstract

The present invention provides a press machine having a pressure equalizing device and a pressure equalizing device. The press machine having a pressure equalizing device comprises a rack, a pluralityof pressing plates mutually arranged at intervals at the rack in the pressing direction, a drive device and a pressure equalizing device. The pressure equalizing device comprises a base arranged at the drive device and having a chamber, and a plurality of pressure units arranged at the installation surfaces of the base, the installation surfaces correspond the pressing plates in the pressing direction, each pressure unit comprises a pressing cavity communicating with the chamber and a piston penetrating the opening end of the pressing cavity and closing the opening end, the opening end is opened facing the pressing plates, the piston can be movably arranged at the opening end in the pressing direction and push against the pressing plate located in the nearest position, the pressing cavities and the chamber commonly form a closed liquid space, the drive device can drive the pressure equalizing device to push against the pressing plate located in the nearest position. When the liquid space is fully filled with liquid, the hydraulic pressure of the piston can be the same, thereby achieving the pressure equalization effect.

Description

technical field [0001] The invention relates to a pressing machine and a pressure equalizing device, in particular to a pressing machine and a pressure equalizing device capable of uniform pressure. Background technique [0002] A general printed circuit board (Printed Circuit Board; PCB) is a multi-layer board made by stacking multi-layer materials such as insulating substrates and copper foil, and is pressed and flattened by high-temperature pressing and cooling of pressing equipment. refer to figure 1 and figure 2 , there is an existing pressing machine 8 for the lamination process of multilayer printed circuit boards. The pressing machine 8 includes a frame 81, a plurality of pressing plates 82 arranged on the frame 81 and spaced up and down, and a connecting The lowermost pressing plate 82 is used to drive the pressing plate 82 to move up and down to approach or move away from the hydraulic cylinder 83 . When carrying out the pressing process, a plurality of cut and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4611H05K2203/068
Inventor 冈崎静明
Owner 冈崎静明
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