Packaged 360-degree light emitting diode

Abstract

The invention provides a packaged 360-degree light emitting diode, and relates to the technical field of diodes. A thermally conductive solid crystal bottom plate and a solder wire bottom plate are inserted in a molding adhesive body, and a patch pad is fixed on the outer side of the thermally conductive solid crystal bottom plate and the solder wire bottom plate. The chip is fixed on the thermally conductive solid crystal bottom plate, and the chip first electrode on the chip is connected with the thermally conductive solid crystal bottom plate by a first solder wire and the chip second electrode on the chip is connected with the solder wire bottom plate by a second solder wire. The chip, the chip first electrode, the chip second electrode, the first solder wire and the second solder wireare all arranged inside the molding adhesive body. A first adhesive guide groove is arranged at the bottom of the thermally conductive solid crystal bottom plate. A second adhesive guide groove is arranged at the bottom of the solder wire bottom plate. The adhesive guide groove on the back of the solid crystal bottom plate and the solder wire bottom plate are insulated by air, and the 360-degreeluminous effect can be achieved.

Description

technical field [0001] The invention relates to the technical field of diodes, in particular to a packaged 360° light emitting diode. Background technique [0002] A light-emitting diode is a solid-state semiconductor device that can directly convert electrical energy into light energy. The light-emitting part of the light-emitting diode is a semiconductor chip. One end of the chip is attached to a bracket, which is the negative pole, and the other end is connected to the positive pole of the power supply. The entire chip is encapsulated by epoxy resin. Light-emitting diode chip is made up of two parts, and a part is P-type semiconductor, and hole occupies an leading position in it, and the other end is N-type semiconductor, is mainly electron here. But time these two kinds of semiconductors couple together, between them, just form a "P-N junction". When the current acts on the chip through the wire, the electrons will be pushed to the P region, and in the P region, the el...

AI Technical Summary

Problems solved by technology

It is to mold a layer of colloid on the surface of the plane PCB. It only emits light on five sides, and the light angle is only 180°, which cannot meet the needs of the lighting range.

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