Circuit board forming method

Abstract

The invention discloses a circuit board forming method, which comprises the following steps: 1, the surface of the circuit board is covered with an electrostatic film; 2, the circuit board is punchedand cut by using a punching die according to design requirements; 3, the electrostatic film is removed from the cut circuit board, and all the waste generated by punching is taken out at the same time; and 4, the cut circuit boards are arranged in order to be put in a material box. The circuit board forming method disclosed in the invention uses the electrostatic adsorption function of the electrostatic film to take out all the waste generated by punching. The efficiency of removing the waste is high, the accuracy is high, and the subsequent automatic installation efficiency of the cut circuitboard is improved.

Description

Technical field [0001] The invention relates to the improvement of the manufacturing method of the circuit board, in particular to a molding method of the circuit board which uses the principle of electrostatic adsorption to quickly and cleanly remove the waste in the molding hole. Background technique [0002] As attached Figure 1-2 As shown, the circuit board manufactured according to the traditional method generally has a plurality of circuit board units with specific functions regularly arranged on a board; the circuit board units with specific functions need to be punched and cut for mounting holes. Conventional stamping dies are usually used for punching and cutting. When the stamping die is withdrawn, the waste in the mounting hole cannot be completely removed. There will always be waste remaining in the mounting hole, which will give the circuit board with specific functions in the future. The unit is automatically installed on the product, which increases the difficulty....

AI Technical Summary

Problems solved by technology

[0002] as attached Figure 1-2 As shown, the circuit board made by the traditional method generally has a plurality of circuit board units with specific functions regularly arranged on one board; the circuit board units with specific functions need to punch installation holes and cut, currently Conventional stamping dies are usually used for punching and cutting. When the stamping die is withdrawn, the waste in the mounting hole cannot be completely removed, and there is always waste in the mounting hole, which will give a circuit board with specific functions in the future. The automatic installation of the unit on the product increases the difficulty, so the automatic installation of the circuit board unit with specific functions on the product needs to ensure that all the waste in the installation hole comes out

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