Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method, system, and apparatus for transfer of dies using a pin plate

a technology of pin plate and transfer die, applied in the field of electronic device assembly, can solve the problems of limited throughput volume drawback, limited placement accuracy of pick and place techniques,

Inactive Publication Date: 2005-01-27
SYMBOL TECH INC
View PDF99 Cites 58 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Pick and place techniques involve complex robotic components and control systems that handle only one die at a time.
This has a drawback of limiting throughput volume.
Furthermore, pick and place techniques have limited placement accuracy, and have a minimum die size requirement.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method, system, and apparatus for transfer of dies using a pin plate
  • Method, system, and apparatus for transfer of dies using a pin plate
  • Method, system, and apparatus for transfer of dies using a pin plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0071] 1. Overview

[0072] The present invention provides improved processes and systems for assembling electronic devices, including RFID tags. The present invention provides improvements over current processes. Conventional techniques include vision-based systems that pick and place dies one at a time onto substrates. The present invention can transfer multiple dies simultaneously. Vision-based systems are limited as far as the size of dies that may be handled, such as being limited to dies larger than 600 microns square. The present invention is applicable to dies 100 microns square and even smaller. Furthermore, yield is poor in conventional systems, where two or more dies may be accidentally picked up at a time, causing losses of additional dies. The present invention allows for improved yield values.

[0073] The present invention provides an advantage of simplicity. Conventional die transfer tape mechanisms may be used by the present invention. Furthermore, much higher fabricati...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method and system for device assembly and a method, system, and apparatus for transfer of dies using a pin plate are described herein. A die plate is received having dies. The body of the die plate has a plurality of holes extending therethrough. Each die covers a corresponding hole on a first surface of the die plate. The die plate is positioned to be closely adjacent to the web of substrates. The punching device has a plurality of punching members extending from an outer surface. The punching device is planar or alternatively cylindrical. The punching device is applied to a second surface of the die plate to cause a set of the punching members to extend through a set of holes in the die plate, causing dies to be transferred from the die plate to one or more destination substrates or other surfaces.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application claims the benefit of U.S. Provisional Application No. 60 / 477,735, filed Jun. 12, 2003 (Atty. Dkt. No. 1689.0350000), which is herein incorporated by reference in its entirety. [0002] The following applications of common assignee are related to the present application, have the same filing date as the present application, and are herein incorporated by reference in their entireties: [0003]“Method And Apparatus For Expanding A Semiconductor Wafer,” U.S. Ser. No. ______ (Atty. Dkt. No. 1689.0520000); [0004]“Method, System, And Apparatus For Authenticating Devices During Assembly,” U.S. Ser. No. ______ (Atty. Dkt. No. 1689.0530000); [0005]“Method, System, And Apparatus For Transfer Of Dies Using A Die Plate Having Die Cavities,” U.S. Ser. No. ______ (Atty. Dkt. No. 1689.0540000); [0006]“Method, System, And Apparatus For Transfer Of Dies Using A Die Plate,” U.S. Ser. No. ______ (Atty. Dkt. No. 1689.0550000); [0007]“Method, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): B23P19/00G06K19/077G08B13/14H01L21/00H01L21/44H01L21/60H01L21/68H01L21/78H01L29/06H01R43/00H04Q5/22H05K3/00H05K3/36
CPCG06K7/0095Y10T156/1142G06K19/045G06K19/077G06K19/07718G11B7/26G11B23/0021G11B23/0042H01L21/67132H01L21/67144H01L21/68H01L21/6835H01L21/78H01L24/75H01L24/81H01L24/95H01L2221/68322H01L2221/68354H01L2223/54473H01L2224/16H01L2224/75H01L2224/81801H01L2224/83192H01L2924/01005H01L2924/01013H01L2924/01039H01L2924/01047H01L2924/01057H01L2924/01075H01L2924/01079H01L2924/09701H01L2924/14H01L2924/19041H01L2924/19042H01L2924/19043H01L2924/3011H01L2924/3025H01L2924/01006H01L2924/01033H01L2924/014Y10S438/976Y10T29/53178Y10T29/49126Y10T29/49155Y10T29/53187Y10T29/49798Y10T156/1978Y10T156/1983Y10T29/49018Y10T29/4913Y10T29/49165Y10T156/1075Y10T156/1906Y10T156/1179Y10T29/49833Y10T29/53422Y10T29/49117Y10T29/49124Y10T29/5327G06K19/041H01L2924/12042H01L2924/00014H01L2924/00H01L2224/0401
Inventor ARNESON, MICHAEL R.BANDY, WILLIAM R.
Owner SYMBOL TECH INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com