Laser indirect compound micro plastic forming device and method

A micro-plastic and laser technology, which is applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems that cannot solve the composite process of deep drawing, edge trimming and punching, and cannot achieve mass production of a single part. Low utilization rate and other issues, to achieve the effect of great flexibility, precise and controllable parameters, and strong adaptability

Inactive Publication Date: 2011-04-13
JIANGSU UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

A patented laser shock micro-volume forming method and device for micro-devices and a patented strong laser shock micro-plastic forming method and device. The composite process of the process cannot realize the mass production of a single part. Second, the flying piece is formed by the impact and shearing of the metal film by the laser, and the utilization rate of the laser energy is low.

Method used

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  • Laser indirect compound micro plastic forming device and method
  • Laser indirect compound micro plastic forming device and method
  • Laser indirect compound micro plastic forming device and method

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Embodiment Construction

[0028] Combine below figure 1 Describe in detail the details and working conditions of the specific device proposed by the present invention.

[0029] The installation consists of 11 parts. The computer 11 controls the laser controller 9, and the laser controller 9 can adjust the indicating light and laser parameters emitted by the nanosecond laser 8. The indicating light or pulsed laser light emitted by the nanosecond laser passes through the first reflector 7 , the second reflector 6 and the focus lens 5 to the sample system 4 below the focus lens 5 . The sample system is placed in the clamp body 3, and the clamp body 3 is installed on the three-dimensional mobile platform 2. The three-dimensional mobile platform 2 is installed on an L-shaped base, and the displacement adjustment of the three-dimensional mobile platform 2 is regulated by a three-dimensional mobile platform controller 10 controlled by a computer 11 . The specific process of implementation is as follows:

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Abstract

The invention discloses a laser indirect compound micro plastic forming device, belonging to the field of laser processing technology of parts of MEMS (Micro-electromechanical Systems). The laser indirect compound micro plastic forming device consists of a laser loading system, a forming system and a control system. In a laser indirect compound micro plastic forming method, pulse laser is used for driving a flying plate to move at a high speed; after moving for a certain distance, the flying plate collides with a target workpiece on a special compound micro die at a high speed; and the collided target workpiece gets high-energy momentum and is extruded between the flying plate and the special compound micro die. Since the target workpiece is limited by the special compound micro die, the target workpiece forms the shape of the special compound micro die during the extruding process. The special compound micro die is provided with hollowing dies and terrace dies which are arranged in arrays, so that the compound process of drawing, punching and trimming and batch forming of the target workpiece can be realized by primary impacting, and the hollowing dies and the terrace dies on thespecial compound micro die can be designed according to the forming and quantity of the target workpieces as required so that the batch forming of the target workpiece can be realized under differentforming requirements.

Description

technical field [0001] The invention belongs to the technical field of laser processing microelectromechanical system (MEMS) parts, in particular to a laser composite microplastic forming method and device. Background of the invention [0002] With the rapid development of electronic products, biology, medical equipment and micro-electro-mechanical systems, the demand for micro-products with light, thin, short, small and multi-functional characteristics is increasing, and the processing of related micro-metal parts is becoming more and more important. It is becoming more and more important, which drives the development of metal microforming technology. Miniature metal products manufactured by micro-forming are widely used in many fields such as automation, medical and health care, aerospace, telecommunications electronics, precision instruments, and national defense. On the one hand, it has better performance and functions, and miniaturization has become an important direct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00B23K26/18B23K26/42B23K26/38B23K26/70
Inventor 刘会霞王鹤军王霄沈宗宝李品陶茂科许贞凯宋新华黄志辉郑远远李威张成王凯张虎
Owner JIANGSU UNIV
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