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Housing assembly and manufacturing method, electronic device

A technology for shell components and manufacturing methods, which is applied in the direction of electrical equipment shells/cabinets/drawers, battery pack components, batteries, etc., and can solve the problems of small thickness of the bottom surface of the limit groove and difficult injection molding of the front shell.

Active Publication Date: 2021-03-05
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, because the thickness of the silicone sleeve is relatively large, the depth of the upper limit groove on the front shell is relatively deep. At the same time, since the first sound transmission hole and the second sound transmission hole are located on the side of the electronic device, limited to the position of the electronic device in the related art The frame of the non-display area is getting smaller and smaller, and the thickness of the bottom surface of the above-mentioned limiting groove is small, which makes it difficult for the front shell to be injection molded

Method used

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  • Housing assembly and manufacturing method, electronic device
  • Housing assembly and manufacturing method, electronic device
  • Housing assembly and manufacturing method, electronic device

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Embodiment Construction

[0031] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.

[0032] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification only for convenience, for example, according to the description in the accompanying drawings directions for the example described above. It will be appreciated that if the illustrated device is turned over so that i...

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Abstract

The invention relates to the technical field of electronic equipment. The invention provides a manufacturing method of a shell component. The method comprises the steps that: a front shell and a battery cover are provided, a first sound transmission hole is formed in the battery cover, a second sound transmission hole corresponding to the first sound transmission hole is formed in the front shell,and a groove surrounding the second sound transmission hole is formed in the side, used for abutting against the battery cover, of the front shell; the groove is filled with a colloid material, and the colloid material is protruded out of the groove; and the colloid material is cured, and the front shell and the battery cover are assembled to allow the cured colloid material to be abutted againstbetween the front shell and the battery cover. The manufacturing method of the shell component can reduce the depth of the front shell groove on the basis of achieving sealing of the first transmission hole and the second transmission hole so as to solve the technical problem that the front shell is difficult to perform injection moulding.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a housing assembly, a manufacturing method, and electronic equipment. Background technique [0002] Electronic equipment, such as mobile phones, pads, notebook computers, etc., generally include a front case and a battery cover, the battery cover is provided with a first sound transmission hole, and the front case is provided with a second sound transmission hole corresponding to the first sound transmission hole. The electronic device can send and receive sound signals through the first sound hole and the second sound hole. Usually, a sealing arrangement is required between the front case and the battery cover to seal the gap between the first sound transmission hole and the second sound transmission hole, so as to ensure the sound transmission effect of the sound transmission hole. [0003] In the related art, the side of the front shell used to abut the battery c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/16
CPCH01M2220/30H05K5/061H05K5/062H01M50/20Y02E60/10
Inventor 金翔
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD