Housing, electronic device and control method
A technology for electronic equipment and shells, which is applied in the field of electronic equipment and can solve problems such as electronic equipment that needs to be improved
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example 1
[0055] The shell body is made of glass, and the first cover plate in the first through hole for carrying the laser sensor is made of acrylic plastic. The light transmittance of acrylic plastic is 90%, the tensile stress is 160MPa, the strength is 160MPa, and the weight density is 1g / cm 3 , the bending stress is 90MPa, and the wear index is 10mg / 10000 times; the second cover plate in the second through hole for carrying the flashlight and the third cover plate in the third through hole for carrying the camera module are all made of glass .
[0056] No debris is generated during shell preparation.
example 2
[0058] The shell body is made of glass, and the first cover plate in the first through hole for carrying the laser sensor is made of acrylic plastic. The light transmittance of acrylic plastic is 89%, the tensile stress is 140MPa, the strength is 140MPa, and the weight density is 0.8 g / cm 3 , the bending stress is 80MPa, and the wear index is 8mg / 10000 times; the second cover plate in the second through hole for carrying the flashlight and the third cover plate in the third through hole for carrying the camera module are all made of glass .
[0059] No debris is generated during shell preparation.
example 3
[0061] The shell body is made of glass, and the first cover plate in the first through hole for carrying the laser sensor is made of acrylic plastic. The light transmittance of acrylic plastic is 91%, the tensile stress is 180MPa, the strength is 180MPa, and the weight density is 1g / cm 3 , the bending stress is 100MPa, and the wear index is 9mg / 10000 times; the second cover plate in the second through hole for carrying the flashlight and the third cover plate in the third through hole for carrying the camera module are all made of glass .
[0062] No debris is generated during shell preparation.
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Abstract
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