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A kind of porous polytetrafluoroethylene copper clad laminate and its preparation method

A polytetrafluoroethylene and polytetrafluoroethylene technology, which is applied in the field of porous polytetrafluoroethylene copper clad laminate and its preparation, can solve the problems affecting the application of PTFE copper clad laminate, lack of long-term effect of bonding, insufficient adhesion and the like , to achieve the effect of durable adhesion, low production cost and low dielectric constant

Active Publication Date: 2021-07-13
UNIV OF ELECTRONICS SCI & TECH OF CHINA ZHONGSHAN INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The printed circuit board (PCB) copper clad laminates manufactured by the above method have a common outstanding problem that the bonding lacks long-term performance. In the process of over-high temperature baking oven or long-term use, PTFE and copper foil or PTFE and epoxy resin There will be problems such as blistering and delamination between FR-4 substrates, which will seriously affect the practical application of PTFE copper clad laminates.

Method used

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  • A kind of porous polytetrafluoroethylene copper clad laminate and its preparation method
  • A kind of porous polytetrafluoroethylene copper clad laminate and its preparation method
  • A kind of porous polytetrafluoroethylene copper clad laminate and its preparation method

Examples

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Effect test

Embodiment 1

[0042] A preparation method of porous polytetrafluoroethylene copper clad laminate, comprising the following steps:

[0043] (1) Grind and mix the silicon dioxide powder with a particle size of 0.1 μm and PTFE powder evenly, and lay the mixed powder, pure PTFE powder, and mixed powder evenly in order, and then sinter at high temperature and high temperature to form a three-layer structure of PTFE base film;

[0044] (2) The upper and lower surfaces of the PTFE-based film of the three-layer structure are mechanically polished to be smooth, and the epidermis is removed to expose the silicon dioxide particles;

[0045] (3) Soak the PTFE-based film with exposed silicon dioxide particles in an acid etching solution to dissolve the silicon dioxide particles on the surface, and obtain a porous PTFE-based film on the upper and lower surfaces;

[0046] (4) The porous PTFE-based film is treated with oxygen plasma for 800 seconds under the conditions of vacuum degree 20Pa and power 55 w...

Embodiment 2

[0059] A preparation method of porous polytetrafluoroethylene copper clad laminate, comprising the following steps:

[0060] (1) Grind and mix the silica powder with a particle size of 0.01 μm and PTFE powder evenly, and lay the mixed powder, pure PTFE powder, and mixed powder evenly in order, and then sinter at high temperature and high temperature to form a three-layer structure of PTFE base film;

[0061] (2) The upper and lower surfaces of the PTFE-based film of the three-layer structure are mechanically polished to be smooth, and the epidermis is removed to expose the silicon dioxide particles;

[0062] (3) Soak the PTFE-based film with exposed silicon dioxide particles in an acid etching solution to dissolve the silicon dioxide particles on the surface, and obtain a porous PTFE-based film on the upper and lower surfaces;

[0063] (4) The porous PTFE-based film is treated with oxygen plasma for 200 seconds under the conditions of vacuum degree 25Pa and power 70 watts;

...

Embodiment 3

[0072] A preparation method of porous polytetrafluoroethylene copper clad laminate, comprising the following steps:

[0073] (1) Grind and mix the silica powder with a particle size of 1000 μm and PTFE powder evenly, and lay the mixed powder, pure PTFE powder, and mixed powder evenly in order, and then sinter at high temperature and high temperature to form a three-layer structure of PTFE-based film;

[0074] (2) The upper and lower surfaces of the PTFE-based film of the three-layer structure are mechanically polished to be smooth, and the epidermis is removed to expose the silicon dioxide particles;

[0075] (3) Soak the PTFE-based film with exposed silicon dioxide particles in an acid etching solution to dissolve the silicon dioxide particles on the surface, and obtain a porous PTFE-based film on the upper and lower surfaces;

[0076] (4) The porous PTFE-based film is surface-treated with oxygen plasma for 10 seconds under a vacuum of 30 Pa and a power of 95 watts;

[0077...

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Abstract

The invention discloses a porous polytetrafluoroethylene copper-clad laminate, which is composed of a copper foil layer, a first bonding layer, a polytetrafluoroethylene layer, a second bonding layer and an epoxy resin FR‑4 layer, wherein the copper The foil layer is bonded to the polytetrafluoroethylene layer through a first adhesive layer, and the polytetrafluoroethylene layer is bonded to the epoxy resin FR-4 layer through a second adhesive layer, wherein the polytetrafluoroethylene The upper and lower surfaces of the layer have a porous structure, and the size of the pores is 0.01 μm-1000 μm. The porous polytetrafluoroethylene copper-clad laminate of the present invention has long-term adhesiveness; avoids high temperature and toxic gas produced in the sintering process of PCB board; its preparation method is energy-saving and environmentally friendly, has high efficiency and low production cost; it has a dielectric constant Low, excellent and durable adhesion, can be widely used in the manufacture of high-frequency PCB circuit boards such as 5G.

Description

technical field [0001] The invention belongs to the field of copper-clad laminates, and in particular relates to a porous polytetrafluoroethylene copper-clad laminate and a preparation method thereof. Background technique [0002] With the rapid development of the high-frequency communication industry, more and more stringent requirements are put forward for the performance of copper clad laminates. Especially in recent years, the rapid development of the communication industry has put forward urgent requirements for the dielectric properties of substrate materials, which must have two important properties: low and stable dielectric constant (Dk) and as low as possible dielectric loss ( Df), to ensure the integrity and reliability of the signal. [0003] Polytetrafluoroethylene (PTFE) resin, as a completely symmetrical polymer material without branched chain lines, has low dielectric constant and dielectric loss, and has become a typical resin for high-frequency copper clad...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/085B32B15/20B32B27/08B32B27/32B32B27/38B32B7/12
CPCB32B7/12B32B15/085B32B15/20B32B27/08B32B27/322B32B27/38
Inventor 王可徐梦雪王悦辉
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA ZHONGSHAN INST