Space pose measurement method based on multi-microsphere vision probe

Abstract

The invention relates to a spatial pose measurement method based on a multi-microsphere visual probe, in particular to technical methods for manufacturing of a multi-microsphere visual probe and implementing measurement by applying the probe. The multi-microsphere visual probe is connected with a probe substrate and a glass substrate through a tungsten filament cantilever and then four transparentmicrospheres are bonded to the glass substrate through shadowless glue; and the manufacturing of the visual probe is based on micro-nano operation in a microscope environment. The method comprises the following step: representing the pose change of a measured object by a visual probe microsphere group fixedly connected with the measured object in a microscopic imaging environment, that is, converting six-dimensional space motion measurement into three-dimensional displacement measurement of four microspheres. According to the invention, the visual probe manufacturing process is simple; the measurement principle is simple and feasible and the measurement precision is high; and the technical blank of micro-nano-scale six-dimensional pose measurement based on vision is filled.

Description

technical field [0001] The invention relates to a method for measuring spatial posture and posture based on a multi-microsphere visual probe. The multi-microsphere visual probe specifically bonds the probe substrate and the glass substrate containing four transparent balls together through a tungsten wire cantilever, and The probe is fixedly connected to the object to be measured; the space pose measurement is completed through the method of microscopic vision sensing, and the three-dimensional displacement measurement of four transparent balls is used to solve the pose change of the measured object to realize the six-dimensional pose measurement. This method is mainly used in research fields such as micro-nano manipulation and precision docking. Background technique [0002] With the continuous integration and development of micro-nano science and technology and traditional manufacturing industry, in the fields of ultra-precision machining, assembly, and testing research, ...

AI Technical Summary

Problems solved by technology

Although precision positioning technologies represented by capacitive sensors, heterodyne laser interferometers, and precision gratings can achieve displacement measurement with nanometer precision, these technologies have application limitations, and it is difficult to perform three-dimensional measurements on multiple targets at the same time. Positioning, also unable to measure attitude changes

In addition, in the fields of CNC machining centers, chip lithography, and additive manufacturing, which require extremely high precision, the equipment costs of these technologies are also extremely high.

However, traditional visual methods based on feature recognition or template matching are also difficult to achieve high-precision pose discrimination.

[0004] To achieve high-precision pose measurement, traditional measurement techniques are difficult to meet high-dimensional requirements, and visual methods are not well adaptable to complex measurement scenarios

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