A sleeve-type loudspeaker module and its packaging process
A loudspeaker module and sleeve-type technology, applied in the field of loudspeakers, can solve the problems of easy diffusion of hot melt, scald flexible circuit boards, easy scald flexible circuit boards, etc., to reduce station positions, save costs, and reduce scald flexible circuit boards Board Risk Effects
Active Publication Date: 2021-12-07
厦门东声电子有限公司
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Problems solved by technology
The traditional speaker module uses a hot-melt head to melt the hot-melt column. The hot-melt head at high temperature is easy to burn the flexible circuit board, and due to the lack of a limit structure, the hot melt liquid is easy to spread and scald the flexible circuit board.
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[0032] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is some embodiments of the present invention, but not all of them. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the implementation manners in the present invention, all other implement...
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The invention relates to the field of loudspeakers, and provides a sleeve type loudspeaker module and a packaging process thereof. A sleeve-type loudspeaker module, comprising: an upper cover, which includes a recessed accommodation groove; a speaker, accommodated in the accommodation groove; a flexible circuit board, arranged on one side of the upper cover, and The horn is electrically connected, the flexible circuit board is provided with a through hole; the lower cover is fastened with the upper cover. The lower cover includes: a heat dissipation port matched with the horn; a pressure-melting tube, which is arranged on one side of the heat dissipation port and coaxial with the through hole, and the outside of the pressure-melting tube is a cylindrical structure , the inner edge of the upper end of the cylindrical structure is provided with chamfers, the middle part of the pressure-melting cylinder is a hot-melt column, the pressure-melting cylinder (41), the flexible circuit board (3), the raised part ( 13) Lay them together sequentially, and the through hole (31) is arranged between the press-melting cylinder (41) and the raised portion (13).
Description
technical field [0001] The invention relates to the field of loudspeakers, in particular to a sleeve type loudspeaker module and its packaging process. Background technique [0002] Currently, speaker modules are an integral part of electronic products. The traditional speaker module uses a hot-melt head to melt the hot-melt column. The high-temperature hot-melt head is easy to burn the flexible circuit board, and due to the lack of a limit structure, the hot melt liquid is easy to spread and burn the flexible circuit board. Contents of the invention [0003] The invention provides a sleeve type loudspeaker module and its packaging process, which can effectively solve the above problems. [0004] The present invention is achieved like this: [0005] A sleeve type speaker module, comprising: [0006] an upper cover, which includes a sunken accommodation groove, and the upper cover is provided with a raised portion; [0007] a horn, accommodated in the accommodating groo...
Claims
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IPC IPC(8): H04R31/00
CPCH04R31/00H04R2231/003
Inventor 全洪军徐超刘阳洋陈培芳李长火
Owner 厦门东声电子有限公司