Sleeve type loudspeaker module and packaging process thereof
A speaker module and sleeve-type technology, applied in the field of speakers, can solve the problems of easily scalded flexible circuit boards, scalded flexible circuit boards, and easy diffusion of hot melt, so as to reduce the risk of scalding flexible circuit boards and reduce station positions. , cost saving effect
Active Publication Date: 2020-01-07
厦门东声电子有限公司
View PDF17 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
The traditional speaker module uses a hot-melt head to melt the hot-melt column. The hot-melt head at high temperature is easy to burn the flexible circuit board, and due to the lack of a limit structure, the hot melt liquid is easy to spread and scald the flexible circuit board.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is some embodiments of the present invention, but not all of them. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the implementation manners in the present invention, all other implement...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to the field of loudspeakers, and provides a sleeve type loudspeaker module and a packaging process thereof. The utility model relates to a sleeve type loudspeaker module, whichcomprises an upper cover,a loudspeaker i accommodated in the accommodating groove; a flexible circuit board arranged on one side of the upper cover and electrically connected with the loudspeaker, wherein a through hole is formed in the flexible circuit board; and a lower cover buckled with the upper cover. The lower cover comprises a heat dissipation port matched with the horn; the pressure melting barrel is arranged on one side of the heat dissipation opening and is coaxial with the through hole, the outer side of the pressure melting barrel is of a barrel-shaped structure, a chamfer is arranged on the edge of the inner side of the upper end of the barrel-shaped structure, and a hot melting column is arranged in the middle of the pressure melting barrel. According to the invention, the hot melting column is melted by utilizing ultrasonic waves, so that the risk of scalding an effective circuit of the flexible circuit board due to diffusion of hot melting liquid of the hot meltinghead is avoided.
Description
technical field [0001] The invention relates to the field of loudspeakers, in particular to a sleeve type loudspeaker module and its packaging process. Background technique [0002] Currently, speaker modules are an integral part of electronic products. The traditional speaker module uses a hot-melt head to melt the hot-melt column. The high-temperature hot-melt head is easy to burn the flexible circuit board, and due to the lack of a limit structure, the hot melt liquid is easy to spread and burn the flexible circuit board. Contents of the invention [0003] The invention provides a sleeve type loudspeaker module and its packaging process, which can effectively solve the above problems. [0004] The present invention is achieved like this: [0005] A sleeve type speaker module, comprising: [0006] an upper cover, which includes an indented accommodating groove; [0007] a horn, accommodated in the accommodating groove; [0008] A flexible circuit board is arranged o...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H04R31/00
CPCH04R31/00H04R2231/003
Inventor 全洪军徐超刘阳洋陈培芳李长火
Owner 厦门东声电子有限公司