PCB processing method

Abstract

The invention relates to the field of PCBs, in particular to a PCB processing method. The method comprises the following steps: forming a to-be-plated brass pattern of each golden finger on the surface of an outer layer of a PCB, wherein the end part of each golden finger is close to the outer edge of the PCB, and the tail part of each golden finger is close to the inner side of the PCB; forming abrass-plated lead on the surface of the outer layer of the PCB, wherein the brass-plated lead avoids the end part position of each golden finger at the position close to the inner side of the PCB, and the brass-plated patterns of all golden fingers are communicated with each other; performing brass plating treatment on the to-be-brass-plated pattern of each golden finger on the surface of the outer layer of the PCB through the brass-plated lead, wherein the golden fingers subjected to brass plating treatment are communicated with one another through the brass-plated lead; performing the depthcontrol machining of the outer layer of the PCB on the portion, communicated between the golden fingers, of the brass-plated leads, and cutting the brass-plated lead through a nonmetal concave structure formed through depth control machining, wherein the processing depth of the depth control machining is less than or equal to the thickness between the golden finger and the inner layer of the PCB.

Description

technical field [0001] The invention relates to the field of PCBs, in particular to a PCB processing method. Background technique [0002] In order to realize the electrical connection between the PCB and other electronic devices such as the motherboard, it is usually necessary to form gold fingers on the PCB for electrical connection pins. [0003] In the prior art, in the process of forming gold fingers on the PCB, it is necessary to use the brass-plated leads temporarily added to the PCB to realize the brass-plated gold fingers, and to remove the brass-plated leads after the brass plating is completed, so as to avoid the need The gold fingers with independent electrical properties are connected to each other by gold-plated leads. The process specifically includes: [0004] First, form the brass pattern to be plated of each gold finger on the surface of the PCB outer layer; wherein, the end of each gold finger is used as a contact, and the end position of each gold finge...

AI Technical Summary

Problems solved by technology

Among them, for the case of equal-length gold fingers, the method of removing the brass-plated leads by surface milling in the above process can ensure that the equal-length gold fingers have the correct shape, and for the case of non-equal length gold fingers, as described in CN201410149118.0 The processing method of the gold finger of the circuit board and the gold finger circuit board described above, the method of removing the brass-plated lead wire by surface milling in the above process will easily lead to the residual lead wire at the end of the short gold finger, and thus affect the non-equal length gold finger. Timing requirements to be met