Anti-scratch method for printed circuit board
A printed circuit and circuit board technology, which is applied in the fields of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems such as high defective rate of gold surface scratches, gold surface scratches, and abnormal gold surface scratches after gilding , to achieve the effect of avoiding gold scratches, eliminating the chance of scratches, and good gold surface appearance
Inactive Publication Date: 2016-04-27
昆山元茂电子科技有限公司
View PDF8 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0002] In the process of making the gold plate, there are often scratches on the gold surface, mainly due to the rubbing of the dew nickel, and secondly, the scratch on the copper surface before the gold plate, which causes the abnormal scratch on the gold surface after the gold plate; the reason is that the forming process Among them, the boards are prone to friction with the scraps of the target pulp board. In the production of other processes, improper operation of the operator will cause friction between boards, boards and tools (equipment), resulting in a high defect rate of scratches on the gold surface.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0014] In order to further reveal the technical solutions of the present invention, the following describes the implementation of the present invention in detail in conjunction with the accompanying drawings: figure 1 As shown, the technical solution adopted in the present invention is: a printed circuit board anti-scratch method, comprising the following steps:
[0015] (1) Anti-soldering: Leave the through holes and their annular rings to be soldered on the circuit board, and seal all the lines and substrates with oil film to save the amount of solder and prevent short circuits and bridging caused by wave soldering. During production, the operator handles the board gently to avoid friction between the board and the tool, and between the board and the board.
[0016] (2) Pretreatment of chemical gold: use physical sandblasting and brushing to remove oxidation, roughen the copper surface, and increase the adhesion of chemical gold to the copper surface. During production, the...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses an anti-scratching method for a printed circuit board, which comprises the following steps of (1) carrying out solder mask processing; (2) carrying out processing before chemical gold plating; (3) forming; (4) carrying out verification; (5) carrying out chemical gold plating; and (6) testing. According to the anti-scratching method, due to the adoption of a method of firstly forming and then carrying out chemical gold plating, chemical gold plating scratches caused in the forming process is avoided. Slight copper surface scratch caused in the forming process can be roughened and leveled off in a microetching groove for chemical gold plating; after chemical gold plating, excellent gold surface appearance can be kept; after chemical gold plating, testing is directly carries out; and the probability that the board which is subjected to chemical gold plating is scratched is eliminated.
Description
technical field [0001] The invention relates to an anti-scratch method for a printed circuit board, which belongs to the technical field of printed circuit board manufacturing technology. Background technique [0002] In the process of making the gold plate, there are often scratches on the gold surface, mainly due to the rubbing of the dew nickel, and secondly, the scratch on the copper surface before the gold plate, which causes the abnormal scratch on the gold surface after the gold plate; the reason is that the forming process Among them, the boards are prone to friction with the scraps of the target pulp board. In the production of other processes, improper operation of the operator will cause friction between boards, boards and tools (equipment), resulting in a high defect rate of scratches on the gold surface. . Contents of the invention [0003] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a method for preventing...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
Inventor 陈金龙韩业刚
Owner 昆山元茂电子科技有限公司