Mass pitch adjustment method, mass transfer method and equipment for tiny electronic components

Abstract

The invention discloses a method for adjusting a huge amount of spacing of tiny electronic components, a method and equipment for mass transfer, and belongs to the field of tiny electronic components. Adsorbed to the bottom of the suction cup; step S200: move the suction cup above the distributed carrying platform, so that the array of tiny electronic components reaches a set height from the scattered carrying platform, and make the suction cup rotate forward at a set angular velocity; step S300: release the suction cup The array of tiny electronic components, the array of tiny electronic components is centrifugally dispersed during the falling process, and then falls on the dispersive bearing platform. The invention realizes massive dispersion and huge spacing adjustment through centrifugal dispersion, has high yield, low out-of-control rate, and is easy to realize precise dispersion control.

Description

technical field [0001] The invention relates to the field of tiny electronic components, in particular to a method for adjusting a huge amount of space between tiny electronic components, a method for mass transfer and equipment. Background technique [0002] Micro-LED not only has the advantages of LCD and OLED, but also has better display performance than LCD and OLED. For example, the brightness of Micro-LED is above 100,000 lux and the service life is about 80,000-100,000 hours. Based on the advantages of Micro-LEDs that fully surround LCD and OLED, it can be expected that Micro-LEDs will be ubiquitous in the future, ranging from foldable devices, AR / VR, to 146-inch video walls, all of which are Micro-LED application scenarios. [0003] In order to realize the application of Micro-LED, it is necessary to transfer a large number (tens of thousands to tens of millions) of Micro-LED chips on the wafer to the driving circuit board to form a three-color mixed LED array with a...

AI Technical Summary

Problems solved by technology

[0007] 1. Placing Micro-LED chips on a rubber carrier can increase friction, but Micro-LED devices are extremely small and light, and it is difficult to ensure that some devices in a huge Micro-LED array do not stick to the rubber sheet when placed on a rubber carrier , placed on the rubber carrier sheet will easily lead to deviations when some Micro-LEDs are centrifugally dispersed

[0008] 2. The lifting action is carried out while the dispersion platform is rotating. The rotation and lifting action need to be precisely coordinated, and the control is complicated. Improper coordination will easily lead to deviations in the centrifugal dispersion results.

[0009] 3. Micro-LED devices are extremely small and light, and it is difficult to achieve uniform air blowing on the bearing surface of the rubber carrier sheet. As long as there is a slight difference in air blowing for a large number of Micro-LED devices, the distribution will be deviated

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