A cooling system for big data integration equipment

Abstract

The invention discloses a heat dissipation system of large data integration equipment, which comprises a heat dissipation device main body, a heat dissipation adjustable plate and a high-efficiency heat dissipation device. The top side of the heat dissipation device main body is movably connected with a heat dissipation adjustable plate, and the inner side of the heat dissipation adjustable plate is fixed. It is connected with a high-efficiency heat dissipation device. The bottom end of the main body of the heat dissipation device is movably connected with a heat dissipation mobile portable base. The liquid display scale well reflects the portability of the device's margin observation, and the built-in stable display meter is very convenient for the staff to check the heat dissipation effect. The heat dissipation adjustable plate well reflects the adjustment adaptability of the device, and efficient heat dissipation The device improves the heat dissipation rate of the device very well, and the heat dissipation mobile portable base well reflects the convenience of movement of the device, is suitable for the use of heat dissipation equipment, and has broad development prospects in the future.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation equipment, in particular to a heat dissipation system of a big data integration equipment. Background technique [0002] Electronic radiators are usually heat sinks for heat dissipation of high-power electronic components. There is no external power supply and natural cooling. Most of them are made of aluminum alloy profiles, which are cut to the required size according to the size of the components, such as high-power switch tubes or triodes. Of course, in special cases, ultra-high-power electronic components also have cooling fans. For example, the switching tube of switching power supplies must be equipped with cooling fans. [0003] Because the location of the working area of ​​the big data integration equipment is not fixed, the existing cooling device cannot be flexibly moved according to the position of the device, and it takes a lot of manpower and material resources to carry it, ...

AI Technical Summary

Problems solved by technology

[0003] Since the working area of ​​the big data integration equipment is not fixed, the existing cooling device cannot be flexibly moved according to the location of the equipment, which requires a lot of manpower and material resources for transportation, and the existing cooling device only has simple air cooling or water cooling function, single heat dissipation method, and insufficient heat dissipation rate. At the same time, due to the different sizes of different big data integration devices, the existing heat dissipation system does not have an effective size adjustment and adaptation function

Images