Electronic device with buffer positioning mechanism

Abstract

This case discloses an electronic device with a buffer positioning mechanism, which includes a housing, an internal module and at least one buffer, the housing includes two housings; all internal components of the electronic device are arranged on the carrier to form an internal module, and the internal module is accommodated in Inside the shell, the internal module is not fixed to the shell by any fixing element; the buffer is stuffed and supported between the inner wall of the shell and the outer wall of the internal module that are opposite to each other. Thereby, the effect of anti-collision and anti-drop can be achieved, and the effect that the inner module does not need to be fixed to the outer shell by any fixing element.

Description

【Technical field】 [0001] The present invention relates to an electronic device, in particular to an electronic device with a buffer positioning mechanism. 【Background technique】 [0002] Regarding the electronic device, it mainly includes a casing and most internal components contained in the casing (such as circuit boards and connectors, etc.). The shell includes a seat and a cover which are combined with each other. The seat is recessed to form a recessed space, and the inner surface of the seat protrudes from a plurality of fixing columns. The inner component is fixed on the inner surface of the seat body through the screw connection of a plurality of first screw elements corresponding to each fixing column. The cover body is covered on the seat body corresponding to the recessed space, and the cover body is fixed on the seat body by a plurality of second threaded components. [0003] However, since all the internal components are fixed on most of the fixing posts, once...

AI Technical Summary

Problems solved by technology

[0003] However, since all the internal components are fixed on most of the fixing posts, once the electronic device encounters a collision or drop, the fixing posts will bear all the energy of the collision or drop and break, which does not meet the requirements of today's products for impact resistance and drop resistance

[0004] Furthermore, when producing an existing electronic device, since all internal components are fixed on the base, the base in the housing must be assembled on the production line from the very beginning, resulting in an increased chance of the base being bumped or scratched.

Since users do not buy products with scratches on the shell, once the shell is scratched, it will be discarded as a defective product, which is obviously a waste

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