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Release film and its application

A technology of release film and release layer, which is applied in the direction of printed circuit, laminated printed circuit board, electrical components, etc., can solve the problems of FPC wrinkles, thermal stress concentration, etc., and achieve good release property and excellent adhesive resistance performance Effect

Active Publication Date: 2021-12-28
NINGBO CHANGYANG TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the roll-to-roll technology is used to press FPC, higher requirements are put forward for the release film. The roll-to-roll technology is a continuous pressing of a roll of film. Changes, and the accumulation of dimensional changes in a roll of film is more likely to lead to subsequent thermal stress concentration. If the common release film commonly used in the market is covered in this process, it cannot meet the production process requirements. After pressing, there will still be FPC. wrinkle problem

Method used

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  • Release film and its application
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  • Release film and its application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] This embodiment provides a release film and a preparation method thereof, the steps are as follows:

[0059] (1) poly-4-methylpentene resin is added to the A extruder;

[0060] (2) polypropylene resin, low-density polyethylene resin, and poly-4-methylpentene resin are mixed according to a weight ratio of 4:2:4, and added to the B extruder;

[0061] (3) Composite the melt extruded from the A extruder and the extruded melt from the B extruder according to the structure of A-B-A, and then co-extrude through a coat hanger die to obtain a co-extruded melt. Among them, by adjusting the speed of the metering pump, the melt flow rate of the A layer and the B layer is adjusted, thereby adjusting the thickness of the A layer and the B layer, and the thickness of the A layer and the B layer is shown in Table 1;

[0062] (4) The above-mentioned co-extrusion melt is cast between the matte roller and the rubber roller, and embossed and cooled to form, thus obtaining a rough release ...

Embodiment 2

[0064] This embodiment provides a release film and a preparation method thereof. The difference from Embodiment 1 lies in that the roughness of the matte roller used is different from that of Embodiment 1. Specific steps are as follows:

[0065] (1) poly-4-methylpentene resin is added to the A extruder;

[0066] (2) polypropylene resin, low-density polyethylene resin, and poly-4-methylpentene resin are mixed according to a weight ratio of 4:2:4, and added to the B extruder;

[0067] (3) Composite the melt extruded from the A extruder and the extruded melt from the B extruder according to the structure of A-B-A, and then co-extrude through a coat hanger die to obtain a co-extruded melt. Among them, by adjusting the speed of the metering pump, the melt flow rate of the A layer and the B layer is adjusted, thereby adjusting the thickness of the A layer and the B layer, and the thickness of the A layer and the B layer is shown in Table 1;

[0068] (4) Cast the above-mentioned co...

Embodiment 3

[0070] This embodiment provides a release film and a preparation method thereof. The difference from Embodiment 1 lies in that the roughness of the matte roller used is different from that of Embodiment 1. Specific steps are as follows:

[0071] (1) poly-4-methylpentene resin is added to the A extruder;

[0072] (2) polypropylene resin, low-density polyethylene resin, and poly-4-methylpentene resin are mixed according to a weight ratio of 4:2:4, and added to the B extruder;

[0073] (3) Composite the melt extruded from the A extruder and the extruded melt from the B extruder according to the structure of A-B-A, and then co-extrude through a coat hanger die to obtain a co-extruded melt. Among them, by adjusting the speed of the metering pump, the melt flow rate of the A layer and the B layer is adjusted, thereby adjusting the thickness of the A layer and the B layer, and the thickness of the A layer and the B layer is shown in Table 1;

[0074] (4) Cast the above-mentioned co...

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Abstract

The invention relates to a release film and its application. The structure of the release film comprises a first release layer, a buffer layer positioned on the first release layer, a second release layer positioned on the buffer layer; The peak count of the surface of the buffer layer satisfies: 20 / cm≤peak count≤150 / cm; and / or, the peak count of the surface of the second release layer far away from the buffer layer satisfies: 20 / cm≤peak Count ≤ 150 / cm. The use of the release film can effectively improve the phenomenon of wrinkles after the FPC is pressed, and at the same time, the release film has excellent glue resistance and good release properties.

Description

technical field [0001] The invention relates to a flexible printed circuit board (FPC), in particular to a release film and its application. Background technique [0002] In recent years, electronic products have shown a trend of miniaturization and portability, and the flexible printed circuit board (FPC) has developed rapidly. FPC is formed by laminating the base film, copper foil, and cover film. At present, there are mainly traditional lamination, general Fast pressing and vacuum quick pressing, etc., with the development of technology, FPC roll-to-roll pressing technology began to appear. [0003] The above-mentioned pressing method requires heating during the pressing process. In order to prevent the FPC from being polluted during the high-temperature heating process and thermally bonded to the pressing board, it is necessary to cover the outermost layer of the FPC with a release film during the pressing process. Protect FPC and improve FPC yield. However, when the r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B7/06B32B33/00H05K3/00
CPCB32B7/06B32B33/00H05K3/0058
Inventor 金亚东杨承翰祝炬烨朱正平
Owner NINGBO CHANGYANG TECH