Adhesive composition and adhesive sheet
A composition and adhesive technology, applied in the directions of adhesives, film/sheet adhesives, non-polymer adhesive additives, etc., can solve problems such as lack of electrical conductivity, achieve low thermal fluidity, Excellent flexibility and less glue spillage
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manufacture example 1～4 and C1
[0067]
[0068] To the reaction apparatus equipped with a stirrer, a thermometer, a reflux cooler, and a nitrogen gas introduction pipe, the components (A1), components (A2) and other components, ethyl acetate, and 0.1 part of n-dodecyl mercaptan as a transfer agent and lauryl peroxide as a peroxide-based radical polymerization initiator. Nitrogen gas was enclosed in the reactor, and polymerization reaction was performed at 68° C. for 3 hours under nitrogen flow while stirring, and then polymerization reaction was performed at 78° C. for 3 hours. Then, it was cooled to room temperature, and ethyl acetate was added thereto. Thus, an acrylic copolymer (A) having a solid content concentration of 30% was obtained.
[0069] Table 1 shows the acid value, theoretical Tg, and weight average molecular weight (Mw) of each acrylic copolymer. The acid value is the amount (mg) of KOH required to neutralize 1 g of the non-volatile components of the copolymer. Theoretical Tg is a value ...
Embodiment 1～4 and comparative example 1～5
[0090]
[0091] As shown in Tables 2 and 3, phenolic resin (B) as a thermosetting resin was added to 100 parts of solid content of the acrylic copolymer obtained in Production Examples 1 to 4 and C1 to C2 as the acrylic copolymer (A). Varnish phenolic resin (manufactured by Arakawa Chemical Co., Ltd., trade name Tamanol (registered trademark) 759) and hexamethylenetetramine (manufactured by Ouchi Shinko Chemical Co., Ltd., trade name Nocceler (registered trademark) H) as the amine curing agent (C) ) were mixed to obtain an adhesive composition.
[0092] This adhesive composition was applied on the silicone-treated release paper so that the thickness after drying would be 25 μm. Next, the solvent was removed at 100° C. and dried to obtain a substrate-less adhesive sheet on a release paper.
[0093]
[0094] The adhesive sheets obtained in Examples 1 to 4 and Comparative Examples 1 to 5 were evaluated by the following methods. The results are shown in Tables 2 and 3.
[0...
Embodiment 5～9
[0111]
[0112] Except adding and mixing metal particles (D1) to (D3) as conductive particles (D) in the amount (part) shown in Table 4, an adhesive composition was prepared in the same manner as in Example 1. A substrate-free adhesive sheet was obtained.
[0113] "D1": Nickel-based conductive particles (manufactured by Vale Corporation, trade name nickel powder Type 255, filamentous, average particle size 2.2 to 2.8 μm)
[0114] "D2": Nickel-based conductive particles (manufactured by NOVAMET, trade name HCA-1, flake shape)
[0115] "D3": Copper (core)-silver (plating) conductive particles (manufactured by Toyo Aluminum Co., Ltd., trade name TFM-C05F, spherical shape, average particle diameter 6 μm)
[0116]
[0117] The adhesive sheets obtained in Examples 5 to 9 were evaluated by the method described above. Furthermore, the resistance value was also measured by the following method. The results are shown in Table 4.
[0118] (resistance)
[0119] Insert an adhesive...
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