Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and system for testing system-on-chip chip

A system-on-chip and test method technology, applied in the direction of measuring electricity, measuring devices, measuring electrical variables, etc., can solve the problems of cable signals interfering with each other, signal integrity, limiting test frequency, etc., to improve test efficiency, simplify connection methods, Guaranteed effect of accuracy

Pending Publication Date: 2020-04-17
北京自动测试技术研究所有限公司
View PDF0 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the large number of pins on the SoC, signal integrity issues such as signal interference between cables become the main reason for limiting the test frequency.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and system for testing system-on-chip chip
  • Method and system for testing system-on-chip chip
  • Method and system for testing system-on-chip chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0052] The technical content of the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0053] Such as figure 2 As shown, the testing method of the SoC chip provided by the present invention comprises the following steps:

[0054] Step S1: According to the test specific requirements of each SoC to be tested, respectively customize the first adapter and the second adapter, and establish a connection between the two adapters based on a high-speed serial link.

[0055] Wherein, both the first adapter and the second adapter are customized high-speed serial link adapters based on the specific test requirements of the high-speed serial link and the system-on-chip to be tested. Specifically, the first adapter is a vector serialization compression adapter installed at the integrated circuit automatic test equipment (AutomaticTestEquipment, ATE) end; the second adapter is a vector deserialization decomp...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method and a system for testing a system-on-chip chip. The method comprises the following steps: diagnosing and calibrating a first adapter and a second adapter which are connected based on a high-speed serial link; after the diagnosis and calibration are completed, obtaining test excitation vectors and expected vectors of to-be-tested system-on-chip chips one by one through the first adapter, compressing and packaging the test excitation vectors based on the high-speed serial link, and transmitting the compressed and packaged test excitation vectors to the second adapter to obtain a test excitation vector of a certain to-be-tested system-on-chip chip; and verifying the obtained test excitation vector, and if the vector passes verification, correspondingly transmitting the test excitation vector to the input pin of the corresponding to-be-tested system-on-chip chip so as to complete the test. According to the method, a traditional test cable is replaced by a high-speed serial transmission medium, a test excitation vector is serialized and then compressed and added to a verification mechanism, so that mapping from the test excitation vector to an input pinof a to-be-tested system-on-chip chip is completely programmable, and the accuracy of a test result is guaranteed.

Description

technical field [0001] The invention relates to a testing method for a system-on-chip chip, and also relates to a corresponding testing system for a system-on-chip chip, belonging to the technical field of integrated circuit testing. Background technique [0002] In recent years, with the development of mobile Internet, SoC has been widely used. From the perspective of the application requirements and development characteristics of the system-on-chip, the system-on-chip is not like a traditional integrated circuit. It is no longer a circuit with a single function. Analog circuits are precisely integrated. Especially with the expansion of the application field of the SoC chip, more functions, higher integration and faster speed will be integrated in the SoC chip; therefore, there are some new requirements for SoC chip testing, such as : How to meet the ever-increasing and changing test functions of SoCs; how to solve the increase in test costs caused by the expansion of aut...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01R31/3185G01R31/3183
CPCG01R31/318307G01R31/318314G01R31/318536G01R31/318566G01R31/318572G01R31/318583
Inventor 蒋常斌
Owner 北京自动测试技术研究所有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products