Wafer positioning device and thinning machine with same

Abstract

The invention provides a wafer positioning device and a thinning machine with the same, which relate to the technical field of semiconductors. The device comprises a wafer bearing platform, a centralpositioning assembly, a notch detection assembly, a driving shaft and a control part, wherein a bearing area for bearing a wafer to be positioned is formed on one surface of the wafer bearing platform; the central positioning assembly is used for carrying out central positioning on the wafer to be positioned and is connected with one surface, far away from the bearing area, of the wafer bearing table; the notch detection assembly is used for detecting the notch position on the wafer to be positioned, and the notch detection assembly at least comprises a notch detection sensor which is arrangedopposite to the bearing area and has a certain distance from the bearing area; the driving shaft is connected with one surface, far away from the bearing area, of the wafer bearing platform and usedfor driving the wafer bearing platform to rotate; and the control part is connected with the notch detection assembly and the driving shaft and used for receiving signals of the notch detection assembly and controlling the driving shaft to rotate. According to the embodiment of the invention, wafer center positioning and notch angle alignment can be simultaneously realized on the thinning machine.

Description

Technical field [0001] The present invention relates to the field of semiconductor technology, in particular to a wafer positioning device and a thinning machine having the same. Background technique [0002] In the manufacturing process of modern semiconductor special equipment, realizing wafer positioning is a key technology. [0003] In modern production equipment, a common device for positioning the wafer center is the rotation center positioning. However, in the grinding process of the existing thinner machine, while realizing the center positioning of the wafer, the notch of the wafer needs to be angularly aligned, which in turn leads to troublesome and high requirements for wafer positioning. Summary of the invention [0004] In view of this, the present invention provides a wafer positioning device and a thinning machine with the same, which are used for simultaneously realizing wafer center positioning and notch angle alignment on the thinning machine. [0005] To solve the...

AI Technical Summary

Problems solved by technology

However, in the existing thinning machine grinding process, while realizing the positioning of the center of the wafer, it is also necessary to align the angle of the notch of the wafer, which makes the operation of positioning the wafer more troublesome and requires higher requirements.

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