Substrate connector including a spring pin assembly for electrostatic chucks

Abstract

A substrate connector to provide a connection to a substrate during substrate processing includes a spring pin assembly defining a first contact and including a first groove. A retention spring clip includes a body arranged in the first groove and projections extending from the body. A second contact includes a body defining a second groove. The second contact is arranged around the first contactof the spring pin assembly. The projections of the retention spring clip extend into the second groove in the second contact.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to U.S. Utility Patent Application No. 15 / 681,556, filed August 21, 2017. The disclosures of the aforementioned applications are incorporated herein by reference in their entirety. technical field [0003] The present invention relates to substrate processing systems, and more particularly to a substrate connector including a spring pin assembly for an electrostatic chuck used in a substrate processing system. Background technique [0004] The background description provided here is for the purpose of generally presenting the context of the invention. To the extent described in this Background section, the work of the presently referenced inventors, and aspects of the description that may not otherwise be considered prior art at the time of filing, are neither expressly nor impliedly addressed to the present Invented prior art. [0005] During the processing of substrates, such as se...

AI Technical Summary

Problems solved by technology

While conductors 32 allow contacts 30 to move with substrate 14 during processing, conductors 32 and contacts 30 are often made of different materials and experience a CTE mismatch

Over time, due to the CTE mismatch between the conductor 32 and the contact 30, the solder joint between the conductor 32 and the contact 30 experiences fatigue and eventually fails

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