A kind of high thermal conductivity polyimide thermosetting resin containing aromatic ester structure and preparation method thereof
A high thermal conductivity, thermosetting technology, applied in the field of thermosetting resins, can solve the problems of decreased comprehensive performance, poor compatibility and good flame retardancy of materials, and achieve the effect of excellent mechanical
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Embodiment 1
[0038] Add 45mmol of 2,2-bis[4-(4-aminophenoxy)phenyl]propane to 120ml of N-methylpyrrolidone solvent, and dropwise add 22.5 mmol 4-formylphenyl 4-formylbenzoate, keep stirring for 1h, then add 15mmol tris[(4-formylphenoxy)-methyl]ethane dissolved in 100ml N-methylpyrrolidone, continue After reacting for 1 hour, the reaction pre-polymerization solution was coated on a horizontal glass plate, and dried at 120°C for 12 hours to obtain a sheet-like material. Laminate multiple sheets of sheet material into a mold for hot pressing under the conditions of 230°C and 3MPa to obtain polyimide resin target products of different thicknesses ( figure 1 ). The tensile strength, Young's modulus and elongation at break of the resin are 92Mpa, 3.5Gpa and 7.9% respectively, and the bending strength and modulus reach 106MPa and 3.2Gpa respectively. The glass transition temperature is 232°C, the 5wt% thermal decomposition temperature is 435°C, and the thermal conductivity is 0.43W / (m·K). The...
Embodiment 2
[0041]Add 45mmol p-phenylenediamine to 120ml N,N-dimethylacetamide solvent, add dropwise 22.5mmol 4-formylbenzoic acid 4 dissolved in 100ml N,N-dimethylacetamide at 60°C -Formylphenyl ester, keep stirring for 1h, then add 15mmol tris[(4-formylphenoxy)-methyl]propane dissolved in 100ml N,N-dimethylacetamide, continue the reaction for 1h, and then The reaction solution was poured into water, filtered, and dried to obtain an orange-yellow solid. The obtained solid is put into a mold and carried out hot pressing, the condition is 250 ℃, 4MPa, obtains polyimide resin target product ( image 3 ). The tensile strength, Young's modulus and elongation at break of the resin are 96Mpa, 3.8Gpa and 4.6% respectively, and the bending strength and modulus reach 103MPa and 3.3Gpa respectively. The glass transition temperature is 243°C, the 5wt% thermal decomposition temperature is 435°C, and the thermal conductivity is 0.46W / (m·K). The flame retardant level reaches UL94 V-0 (1.6mm) level. ...
Embodiment 3
[0044] Add 45 mmol of 4-aminophenyl 4-aminobenzoate to 120 ml of dimethyl sulfoxide solvent, and add 30 mmol of tris[(4-formylphenoxy) dissolved in 100 ml of dimethyl sulfoxide at 60°C -Methyl]ethane, react for 1 hour, then apply the reaction pre-polymerization solution on a horizontal glass plate, and dry it at 120°C for 12 hours to obtain a sheet-like material. A plurality of sheets of sheet materials are stacked and put into a mold for hot pressing under the conditions of 240°C and 3MPa to obtain the target product of polyimide resin ( Figure 4 ). The tensile strength, Young's modulus and elongation at break of the resin are 104Mpa, 4.0Gpa and 3.2% respectively, and the bending strength and modulus reach 112MPa and 3.7Gpa respectively. The glass transition temperature is 246°C, the 5wt% thermal decomposition temperature is 440°C, and the thermal conductivity is 0.37W / (m·K). The flame retardant level reaches UL94 V-0 (1.6mm) level. The prepared resin was placed in 50ml o...
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