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Wafer cleaning method and wafer post-processing device

A wafer and cleaning brush technology, applied in cleaning methods and utensils, cleaning methods using tools, chemical instruments and methods, etc., can solve the problems of poor cleaning effect, inability to adjust and control cleaning brushes, etc., to achieve automatic control, The effect of improving the cleaning effect

Active Publication Date: 2020-12-29
HWATSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The contact pressure and contact area of ​​the cleaning brush on the wafer surface will affect the cleaning effect and need to be controlled. However, in the existing technology, the structure and movement parameters of the cleaning brush are generally adjusted manually before installation. If there is a problem during use, it is manually maintained. It is impossible to adjust and control the cleaning brush in real time, which will cause the problem that the cleaning effect will deteriorate as the usage time increases

Method used

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  • Wafer cleaning method and wafer post-processing device
  • Wafer cleaning method and wafer post-processing device
  • Wafer cleaning method and wafer post-processing device

Examples

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Embodiment Construction

[0021] The technical solutions of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings. The examples described here are specific implementations of the present invention and are used to illustrate the concept of the present invention; these descriptions are all explanatory and exemplary, and should not be construed as limiting the implementation of the present invention and the protection scope of the present invention . In addition to the embodiments described here, those skilled in the art can also adopt other obvious technical solutions based on the claims of the application and the contents disclosed in the specification, and these technical solutions include adopting any modifications made to the embodiments described here. Obvious alternatives and modified technical solutions.

[0022] In this application, a wafer is also referred to as a substrate, and its meaning and actual function are equivalent. ...

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Abstract

The invention provides a wafer cleaning method and a wafer post-processing device. The method comprises the following steps: controlling two cleaning brushes to move to corresponding cleaning positions by utilizing zero point positions, which are determined in a calibration process, of the two cleaning brushes in simultaneous contact with a wafer; and controlling the two cleaning brushes to conduct rolling brushing on the front face and the back face of the wafer at the cleaning positions according to a preset technological process.

Description

technical field [0001] The invention belongs to the technical field of cleaning after chemical mechanical polishing, and in particular relates to a wafer cleaning method and a wafer post-processing device. Background technique [0002] Chemical Mechanical Planarization (CMP) is a global planarization ultra-precision surface processing technology. Due to the large amount of chemical reagents and abrasives used in chemical mechanical polishing, a large amount of pollutants such as abrasive particles and grinding by-products will remain on the surface of the wafer after polishing. These pollutants will have a negative impact on subsequent processes and may cause wafer Round yield loss. Therefore, after chemical mechanical polishing, a post-processing process needs to be introduced. The post-processing process generally consists of cleaning and drying to provide a smooth and clean wafer surface. [0003] In the usual post-processing process, wet cleaning is more commonly used....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67B08B1/02B08B13/00
CPCB08B1/02B08B13/00H01L21/67092
Inventor 许振杰贾弘源
Owner HWATSING TECH