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Mini LED packaging substrate manufacturing process

A manufacturing process and packaging substrate technology, which is applied in the field of Mini LED packaging substrate manufacturing process, can solve problems such as light-emitting device interference and affect application promotion, and achieve the effects of improving packaging quality, preventing partial short circuit of products, and improving display quality

Active Publication Date: 2020-06-05
SHENZHEN ZHIJIN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the deficiencies of the prior art, the purpose of the present invention is to disclose a manufacturing process of the Mini LED packaging substrate, which is used to solve the problem that the existing Mini LED packaging causes mutual interference between the light-emitting devices between the units due to the high integration, which affects the final application. promotion problem

Method used

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  • Mini LED packaging substrate manufacturing process

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Embodiment 1

[0046] see Figure 1-2 , Embodiment 1 of the present invention discloses a Mini LED packaging substrate manufacturing process S100, including:

[0047] S10, providing a motherboard 10, the motherboard 10 includes an insulating board 11 and a first copper foil 12, the insulating board 11 has a first surface 111 and a second surface 112 away from the first surface 111, the first A copper foil 12 is pressed onto the first surface 111;

[0048] S20, processing the first copper foil 12 to form a chip pad 121 and a bonding wire pad 122 spaced from the chip pad 121;

[0049] S30, processing and forming a surrounding wall 123 on the edge of the chip pad 121 away from the insulating plate 11, the surrounding wall 123 and the chip pad 121 enclose to form a cavity 124 for Mini LED packaging .

[0050] Wherein, the chip pad 121 is used for mounting the chip, and the wire bonding pad 122 is used for bonding the wire.

[0051] In this embodiment, by processing the edge of the chip pad 1...

Embodiment 2

[0081] see Figure 5-8 , Embodiment 2 of the present invention discloses a Mini LED packaging substrate manufacturing process S200, including:

[0082] S201, providing a motherboard 201, the motherboard 201 includes an insulating board 202, a first copper foil 203 and a second copper foil 204, the insulating board 202 has a first surface 205 and a second surface away from the first surface 205 surface 206, the first copper foil 203 is attached to the first surface 205, and the second copper foil 204 is attached to the second surface 206;

[0083] S202, drilling identification holes, tool holes and via holes 207 on the motherboard 10;

[0084] S203, on the side of the first copper foil 203 away from the insulating board 202, the side of the second copper foil 204 away from the insulating board 202 and the inner sidewall of the via hole 207, electroplate a copper layer 208 ;

[0085] S204, filling the via hole 207 with an insulating material 222 or a conductive material 222; ...

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Abstract

The invention discloses a Mini LED packaging substrate manufacturing process. The process comprises: providing a mother board, wherein the mother board comprises an insulating board and a first copperfoil, the insulating board is provided with a first surface and a second surface deviating from the first surface, and the first copper foil is pressed on the first surface; machining the first copper foil to form a chip bonding pad and a bonding wire bonding pad spaced from the chip bonding pad; and machining the edge of the side, away from the insulating plate, of the chip bonding pad to form asurrounding wall, and enabling the surrounding wall and the chip bonding pad to define a cavity for Mini LED packaging. According to the Mini LED packaging substrate manufacturing process disclosed by the invention, the surrounding wall is formed by processing the edge of the chip bonding pad; according to the invention, the problem of optical crosstalk among all units after the Mini LED chip ispackaged can be effectively prevented, the display quality is improved, local short circuit of a product caused by flowing glue to two welding spots during chip mounting can be effectively prevented,and the packaging quality is improved.

Description

technical field [0001] The invention relates to the field of packaging substrate manufacturing, in particular to a manufacturing process of a Mini LED packaging substrate. Background technique [0002] With the advent of the 5G era, opportunities and challenges coexist in the field of high-definition display. The topic of how to obtain more stable and higher resolution in a smaller and thinner space is constantly being conceived and realized. The development of LED display substrates from the current 1010, 0808 to 2-in-1, 4-in-1 and 6-in-1 are all efforts to obtain higher integration and higher resolution HD displays. The higher-order Mini LED can increase the integration and resolution by 50% on the basis of N-in-1, but due to the higher integration, the light-emitting devices between each unit interfere with each other, which affects the final application and promotion. Contents of the invention [0003] In order to overcome the deficiencies of the prior art, the purpo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/58H01L33/62H01L25/075H01L27/15
CPCH01L33/48H01L33/62H01L33/58H01L25/0753H01L27/156H01L2933/0033H01L2933/0058H01L2933/0066
Inventor 康孝恒蔡克林唐波杨飞李瑞许凯蒋乐元
Owner SHENZHEN ZHIJIN ELECTRONICS
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