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A kind of cyanide-free copper plating liquid auxiliary agent and copper plating liquid

A cyanide-free copper plating and copper carbonate technology, which is applied in the field of cyanide-free copper plating solution additives and copper plating solutions, can solve the problems of operator threat, unfriendly environment, and inability to obtain a copper-plated layer on the surface of stainless steel, and achieves serious relief. Threat, solve the weak binding force, inhibit the effect of displacement reaction

Active Publication Date: 2021-06-04
山东夸克电化学科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In addition, direct copper plating on the above-mentioned steel substrates, the common copper plating environment is alkaline, such as alkaline cyanide copper plating process, because cyanide is the best complexing agent in the metal electrodeposition process, but has been It cannot be used in an acidic environment, and cyanide has no activation ability on the surface of stainless steel, so a copper plating layer with good adhesion cannot be obtained
Moreover, the high toxicity of cyanide poses a serious threat to operators and is not friendly to the environment.

Method used

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  • A kind of cyanide-free copper plating liquid auxiliary agent and copper plating liquid
  • A kind of cyanide-free copper plating liquid auxiliary agent and copper plating liquid
  • A kind of cyanide-free copper plating liquid auxiliary agent and copper plating liquid

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Embodiment 1

[0031] This embodiment discloses a cyanide-free copper plating solution and a preparation method thereof. During preparation, take 1 / 2 of the required amount of pure water, add copper sulfate to it and stir to dissolve, then add sulfuric acid to it under constant stirring, and then respectively Add complexing agent and additives in turn and stir evenly, add the remaining pure water to the required volume to obtain copper plating solution, and then perform electroplating.

[0032] The copper plating solution that prepares comprises:

[0033]

[0034] After degreasing, pickling, and activation treatment, the stainless steel sheet is placed in the electroplating tank, put the above copper plating solution into the electroplating tank, set the current density to 1A / dm2, and electroplate at room temperature for 10 minutes to complete the stainless steel sheet. Copper plating. After observation, it was found that the copper coating after electroplating is fine and bright, and th...

Embodiment 2

[0036] This embodiment discloses a cyanide-free copper plating solution and a preparation method thereof. During preparation, take 1 / 2 of the required amount of pure water, add copper sulfate to it and stir to dissolve, then add sulfuric acid to it under constant stirring, and then respectively Add complexing agent and additives in turn and stir evenly, add the remaining pure water to the required volume to obtain copper plating solution, and then perform electroplating.

[0037] The copper plating solution that prepares comprises:

[0038]

[0039] After degreasing, pickling, and activation treatment, the stainless steel sheet is placed in the electroplating tank, put the above copper plating solution into the electroplating tank, set the current density to 10A / dm2, and electroplate at room temperature for 10 minutes to complete the stainless steel sheet. Copper plating. After observation, it was found that the copper coating after electroplating is fine and bright, and t...

Embodiment 3

[0041] This embodiment discloses a cyanide-free copper plating solution and a preparation method thereof. During preparation, take 1 / 2 of the required amount of pure water, add copper sulfate to it and stir to dissolve, then add sulfuric acid to it under constant stirring, and then respectively Add complexing agent and additives in turn and stir evenly, add the remaining pure water to the required volume to obtain copper plating solution, and then perform electroplating.

[0042] The copper plating solution that prepares comprises:

[0043]

[0044] The stainless steel sheet is degreased, pickled, and activated in sequence, and then placed in the electroplating tank. Put the above copper plating solution into the electroplating tank, set the current density to 5A / dm2, and electroplate at room temperature for 10 minutes to complete the stainless steel sheet. Copper plating. After observation, it was found that the copper coating after electroplating is fine and bright, and ...

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Abstract

The invention discloses for the first time a copper plating solution auxiliary agent composed of a complexing agent and an additive, and forms a unique cyanide-free copper plating solution by combining with a main salt and a strong acid, so that the dense passivation film layer on the surface of the stainless steel can be quickly dissolved, so that the The surface is quickly activated to expose the stainless steel crystalline structure, thereby providing more deposition sites for copper ions. At the same time, complexing copper ions with a complexing agent reduces the potential of copper ions to inhibit the replacement reaction of copper and iron, and uses the reducibility in the acid copper plating solution to reduce the divalent copper ions on the surface of stainless steel to copper plating at a high speed. Instead of replacing the copper layer, a copper plating layer with dense crystals and super-strong bonding force is formed, and rapid electroplating copper is electrodeposited on the copper plating layer. Successfully solved the technical problems of the copper-iron replacement reaction industry under high acid conditions, and the copper-plated layer has super strong bonding force, reaching the national standard of GB5270‑2005. Direct and rapid copper plating on stainless steel substrates.

Description

technical field [0001] The invention relates to a cyanide-free copper plating liquid additive and a copper plating liquid, belonging to the technical field of electroplating. Background technique [0002] As a special steel, stainless steel is easy to form a thin, transparent and dense passivation film with strong adhesion on its surface, and this film has a strong self-recovery ability, even if it is damaged, it can still regenerate a new passivation film. membrane. It is precisely because of the existence of the passivation film that it is very difficult to electroplate copper on stainless steel materials. After using traditional electroplating solutions and electroplating processes, the bonding force between the coating and the stainless steel substrate is extremely poor, and the electroplating quality is very low. The same problem also exists on cast iron substrates and plain carbon steel substrates. [0003] Therefore, if you want to obtain high-quality stainless stee...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 张志梁
Owner 山东夸克电化学科技有限公司
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