Cyanide-free copper plating solution assistant and copper plating solution

A cyanide-free copper plating and additive technology, which is applied in the field of cyanide-free copper plating additives and copper plating solutions, can solve the problems of threats to operators, unfriendly environment, and the inability to obtain copper plating on stainless steel surfaces, etc. Threat, solve the effect of weak binding force, and inhibit the occurrence of displacement reaction

Active Publication Date: 2020-06-23
山东夸克电化学科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In addition, direct copper plating on the above-mentioned steel substrates, the common copper plating environment is alkaline, such as alkaline cyanide copper plating process, because cyanide is the best complexing agent in the metal electrodeposition process, but has been It cannot be used in an acidic environment, and cyanide has no activation ability on the surface of stainless steel, so a copper plating layer with good adhesion cannot be obtained
Moreover, the high toxicity of cyanide poses a serious threat to operators and is not friendly to the environment.

Method used

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  • Cyanide-free copper plating solution assistant and copper plating solution
  • Cyanide-free copper plating solution assistant and copper plating solution
  • Cyanide-free copper plating solution assistant and copper plating solution

Examples

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Embodiment 1

[0031] This embodiment discloses a cyanide-free copper plating solution and a preparation method thereof. During preparation, take 1 / 2 of the required amount of pure water, add copper sulfate to it and stir to dissolve, then add sulfuric acid to it under constant stirring, and then respectively Add complexing agent and additives in turn and stir evenly, add the remaining pure water to the required volume to obtain copper plating solution, and then perform electroplating.

[0032] The copper plating solution that prepares comprises:

[0033]

[0034] After degreasing, pickling, and activation treatment, the stainless steel sheet is placed in the electroplating tank, put the above copper plating solution into the electroplating tank, set the current density to 1A / dm2, and electroplate at room temperature for 10 minutes to complete the stainless steel sheet. Copper plating. After observation, it was found that the copper coating after electroplating is fine and bright, and th...

Embodiment 2

[0036] This embodiment discloses a cyanide-free copper plating solution and a preparation method thereof. During preparation, take 1 / 2 of the required amount of pure water, add copper sulfate to it and stir to dissolve, then add sulfuric acid to it under constant stirring, and then respectively Add complexing agent and additives in turn and stir evenly, add the remaining pure water to the required volume to obtain copper plating solution, and then perform electroplating.

[0037] The copper plating solution that prepares comprises:

[0038]

[0039] After degreasing, pickling, and activation treatment, the stainless steel sheet is placed in the electroplating tank, put the above copper plating solution into the electroplating tank, set the current density to 10A / dm2, and electroplate at room temperature for 10 minutes to complete the stainless steel sheet. Copper plating. After observation, it was found that the copper coating after electroplating is fine and bright, and t...

Embodiment 3

[0041] This embodiment discloses a cyanide-free copper plating solution and a preparation method thereof. During preparation, take 1 / 2 of the required amount of pure water, add copper sulfate to it and stir to dissolve, then add sulfuric acid to it under constant stirring, and then respectively Add complexing agent and additives in turn and stir evenly, add the remaining pure water to the required volume to obtain copper plating solution, and then perform electroplating.

[0042] The copper plating solution that prepares comprises:

[0043]

[0044] The stainless steel sheet is degreased, pickled, and activated in sequence, and then placed in the electroplating tank. Put the above copper plating solution into the electroplating tank, set the current density to 5A / dm2, and electroplate at room temperature for 10 minutes to complete the stainless steel sheet. Copper plating. After observation, it was found that the copper coating after electroplating is fine and bright, and ...

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Abstract

The invention discloses a copper plating solution assistant composed of a complexing agent and an additive. By combining the copper plating solution assistant with a main salt and a strong acid to form a unique cyanide-free copper plating solution, the cyanide-free copper plating solution can dissolve a compact passivation coating on the surface of stainless steel, so that the surface is activatedquickly to expose stainless steel crystal structures, and therefore, more deposition points are provided to copper ions. Meanwhile, the copper ions are complexed by using the complexing agent, so that potentials of the copper ions are reduced to inhibit a copper-iron replacement reaction. The bivalent copper ions are reduced at a high speed on the surface of the stainless steel to a copper coating by means of reducibility in an acidic copper plating solution, and the compact crystal copper coating with a superstrong binding force rather than a non-replacement copper layer is formed quickly before the replacement reaction, so that the copper ions are electro-deposited on the copper coating to electroplate copper quickly. The technical problem that a copper-iron replacement reaction industry in a high acid condition is solved successfully. The copper coating is superstrong in binding force which reaches the GB5270-2005 national standard. Copper can be plated on a stainless steel substrate directly and quickly.

Description

technical field [0001] The invention relates to a cyanide-free copper plating liquid additive and a copper plating liquid, belonging to the technical field of electroplating. Background technique [0002] As a special steel, stainless steel is easy to form a thin, transparent and dense passivation film with strong adhesion on its surface, and this film has a strong self-recovery ability, even if it is damaged, it can still regenerate a new passivation film. membrane. It is precisely because of the existence of the passivation film that it is very difficult to electroplate copper on stainless steel materials. After using traditional electroplating solutions and electroplating processes, the bonding force between the coating and the stainless steel substrate is extremely poor, and the electroplating quality is very low. The same problem also exists on cast iron substrates and plain carbon steel substrates. [0003] Therefore, if you want to obtain high-quality stainless stee...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 张志梁
Owner 山东夸克电化学科技有限公司
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