Heat sink and mobile terminal

Abstract

Embodiments of the present application provide a heat dissipation device and a mobile terminal. The heat dissipation device includes: a PCB board, a shield cover and a heat sink; the shield cover is located above the PCB board; The peripheral edge of the shielding cover pad position on the PCB board, so that the interference signal is radiated from the slot to the outside world. In the embodiment of the present application, the peripheral edge of the heat sink corresponding to the position of the shielding cover pad on the PCB board is slotted, so that the interference signal is radiated from the slot to the outside world without being blocked by the heat sink or between the heat sink and the PCB board. Multiple reflections are formed between them, so that the heat sink will not affect the receiving performance of the terminal antenna on the basis of ensuring the heat dissipation function, so as to improve the overall performance of the terminal.

Description

technical field [0001] The present application relates to the field of communication technologies, and in particular, to a heat dissipation device and a mobile terminal. Background technique [0002] At present, electronic terminals usually use heat sinks to dissipate heat. By attaching the heat sinks to the housings of electronic products, the purpose of heat dissipation is achieved. However, the high-heat modules on the PCB board of the electronic terminal are usually high-current and high-interference modules. When there is no heat sink, the interference signals generated by each module are directly radiated to the outside of the electronic terminal, without causing interference to each antenna on the electronic terminal. However, when there is a heat sink, since the heat sink is a conductor, the interference signal is reflected back to the PCB board after being blocked by the heat sink, and then radiated again after being excited by each module on the PCB board, and the ...

AI Technical Summary

Problems solved by technology

However, the high-heat modules on the PCB board of the electronic terminal are usually high-current and high-interference modules. When there is no heat sink, the interference signals generated by each module directly radiate outside the electronic terminal, and do not interfere with the antennas on the electronic terminal.

But when there is a heat sink, since the heat sink is a conductor, the interference signal is reflected back to the PCB board after being blocked by the heat sink, and radiated again after being excited by each module on the PCB board, and the interference signal is repeatedly transmitted between the PCB board and the heat sink Oscillation, and finally radiate out at the edge of the heat sink. At this time, the strength of the interference signal has increased several times, causing great interference to the receiving antenna on the electronic terminal, such as receiving diversity and GPS antenna.

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