The invention provides an antenna packaging structure and a packaging method. The packaging method comprises the steps of providing a supporting substrate, forming a rewiring layer, a first antenna layer, a first
metal feed line column, a first packaging layer, a second antenna layer, a second
metal feed line column, a second packaging layer and a third antenna layer, providing a
semiconductor chip, and enabling the
semiconductor chip to be connected to the surface of the rewiring layer, and forming a box dam dispensing
protection layer at least on the top and the periphery of the
semiconductor chip. The multi-layer antenna structure is formed by the multiple
layers of
metal feed line columns and the multiple packaging
layers, the packaging size is reduced, the
signal receiving capacity is enhanced, the
signal receiving bandwidth is expanded, the box dam dispensing process is added for
wafer-level packaging, the stability of the chip is improved, the bottom filling layer is further formed through the bottom filling process, dual protection is conducted on the chip, the packaging process flow can be effectively reduced, and the process period is improved; and the
semiconductor chip, the rewiring layer, the antenna metal and other structures are arranged to be of a vertical arrangement structure, so that the conduction path between the components can be effectively shortened.