Multi-chip package with antenna structure and preparation method thereof

Abstract

The invention relates to a multi-chip package with an antenna structure and a preparation method thereof. The first antenna structure, the second antenna structure, the third antenna structure and the fourth antenna structure are formed in the first preset antenna pattern, the second preset antenna pattern, the third preset antenna pattern and the fourth preset antenna pattern in a spin-coating mode of the metal nanowire solution, through the preparation process, the connection tightness of the antenna structures and the flexible resin packaging layer can be improved conveniently, and then stripping and falling of the antenna structures can be avoided. Furthermore, the first antenna structure and the third antenna structure are stacked, and the second antenna structure and the fourth antenna structure are stacked, so that the signal transmitting strength of the antenna structure or the signal receiving capability of the antenna structure is effectively improved. Meanwhile, due to the arrangement of the first isolation structure and the second isolation structure, interference between the antenna structures, between the semiconductor chips and between redistribution lines can be effectively avoided, and then the function stability of multi-chip packaging is guaranteed.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a multi-chip package with an antenna structure and a preparation method thereof. Background technique [0002] In the preparation process of the existing package structure with antenna, it is usually necessary to directly arrange a semiconductor chip on the circuit substrate. Conventionally, the semiconductor chip is connected to the circuit substrate through a wire bonding process or a flip-chip process. electrical connection, and then a plastic encapsulation resin layer is arranged on the semiconductor chip, and then an antenna structure is arranged on the plastic encapsulation resin layer. The above preparation process may easily lead to an unstable antenna structure, which is prone to peeling and falling off. And when a multi-chip packaging structure is involved, each chip needs to be provided with a corresponding antenna structure, and adjacent antenna structures are l...

AI Technical Summary

Problems solved by technology

[0002] In the preparation process of the existing packaging structure with antenna, it is usually necessary to directly arrange a semiconductor chip on the circuit substrate. In the conventional arrangement, the semiconductor chip is connected to the circuit substrate through a wire bonding process or a flip-chip process. electrical connection, then set a plastic sealing resin layer on the semiconductor chip, and then set the antenna structure on the plastic sealing resin layer, the above preparation process is likely to cause the antenna structure to be unstable, and then easy to peel off and fall off

And when it comes to multi-chip packaging structures, each chip needs to be equipped with a corresponding antenna structure, and adjacent antenna structures are likely to cause signal interference, which in turn affects the normal operation of the multi-chip packaging structure

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