Circuit board and manufacturing method thereof
A manufacturing method and circuit board technology, applied in the directions of printed circuits, printed circuits, printed circuit components, etc., can solve the problems of insufficient potion exchange capacity, inability to ensure the compactness of coatings and interlayers, etc., to prevent intrusion of corrosion conductors, The effect of avoiding peeling off and avoiding corrosion
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[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them.
[0028] Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.
[0029] All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein in the description of the present invention is only for the purpose of describing specific embodiments, and is not intended to limit the present invention.
[0030] Please refer to Figure 1-7 , a preferred embodiment of the...
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