A packaging component and its preparation method

A technology of encapsulating components and encapsulating colloids, which is applied in semiconductor/solid-state device manufacturing, electrical components, semiconductor devices, etc., can solve problems such as limited heat dissipation capacity, achieve the effects of preventing peeling off, optimizing thermal compression bonding process, and excellent heat dissipation performance

Active Publication Date: 2021-09-28
深圳市之诺微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the heat dissipation capability of conventional semiconductor packaging components is limited, therefore, it is necessary to provide a semiconductor packaging component with better heat dissipation performance in this technical field

Method used

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  • A packaging component and its preparation method
  • A packaging component and its preparation method

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Embodiment Construction

[0026] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] A method for preparing a packaging component proposed by the present invention comprises the following steps:

[0028] 1) Provide a heat dissipation substrate, the heat dissipation substrate has a first surface and a sec...

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Abstract

The present invention relates to a packaging component and a manufacturing method thereof. The method comprises the following steps: providing a heat dissipation substrate, etching the second surface of the heat dissipation substrate to form a plurality of concave holes; An insulating layer and a circuit wiring layer are formed on the first surface of the circuit wiring layer; a plurality of semiconductor elements and a plurality of conductive pins are installed on the circuit wiring layer; an encapsulation compound is formed; a plurality of intervals are formed around the encapsulation compound The perforations penetrate the encapsulant; provide a plurality of metal conductive pillars, and then form a plurality of through holes penetrating through the metal conductive pillars on the side of each of the metal conductive pillars, and multiple metal conductive pillars are formed. The conductive pillars are respectively embedded into the corresponding through-holes, and then the encapsulation compound is subjected to a thermocompression bonding process, so that part of the encapsulation compound is embedded in the through holes of the metal conduction pillars.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a packaging component and a preparation method thereof. Background technique [0002] In a conventional manufacturing process of a semiconductor package component, a semiconductor element is electrically connected to a package substrate through a solder material. The semiconductor element is placed on the packaging substrate and aligned to the placement site so that the solder balls are aligned with the pads on the substrate. Then, a reflow soldering process is used to fixedly connect the semiconductor element and the package substrate. For semiconductor packaging components, there are two major challenges in electrical performance and heat dissipation control. In particular, in terms of heat dissipation control, semiconductor package members are required to effectively dissipate heat generated by semiconductor elements. Heat sinks are usually attached to subst...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/373H01L21/56H01L23/31
CPCH01L21/56H01L23/3114H01L23/3677H01L23/3736
Inventor 张正
Owner 深圳市之诺微电子有限公司
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