Antenna packaging structure and packaging method

A packaging method and packaging structure technology, which is applied in the directions of antenna support/mounting device, antenna grounding switch structure connection, antenna, etc., can solve the problems that the chip is difficult to be effectively protected, the number of layers is single, and the volume of the antenna package is large, so as to reduce the Effects of Packaging Process Flow, Low Power Consumption, and High Efficiency Antenna Performance

Pending Publication Date: 2021-04-27
SJ SEMICON JIANGYIN CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide an antenna packaging structure and packaging method, which are used to solve the problems in the prior art that the antenna packaging volume is large, the number of layers is single, and the chip is difficult to be effectively protected.

Method used

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  • Antenna packaging structure and packaging method
  • Antenna packaging structure and packaging method
  • Antenna packaging structure and packaging method

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Embodiment 1

[0098] Such as figure 1 As shown, the present invention provides a kind of antenna packaging method, and described packaging method comprises steps:

[0099] providing a support base on which a temporary bonding layer is formed;

[0100] forming a rewiring layer on the temporary bonding layer, the rewiring layer including a first surface connected to the temporary bonding layer and a second surface opposite to the first surface;

[0101] forming a first antenna layer electrically connected to the redistribution layer on the second surface;

[0102] forming a first metal feeder post electrically connected to the first antenna layer on the first antenna layer;

[0103] encapsulating the first metal feeder column with a first encapsulation layer, and exposing the top surface of the first metal feeder column by the first encapsulation layer;

[0104] forming a second antenna layer electrically connected to the first metal feeder post on the first packaging layer;

[0105] form...

Embodiment 2

[0149] Such as Figure 20 shown, and see Figures 1 to 19 , the present invention also provides an antenna packaging structure, wherein the antenna packaging structure is preferably packaged by the antenna packaging method of the present invention, of course, the antenna packaging structure can also be packaged by other packaging methods, the antenna package Structures include:

[0150] a rewiring layer comprising a first side and a second side opposite to the first side;

[0151] The first antenna layer 301 is formed on the second surface and is electrically connected to the rewiring layer;

[0152] a first metal feeder post 303, formed on the first antenna layer 301 and electrically connected to the first antenna layer 301;

[0153] The first encapsulation layer 305 covers the first metal feeder post 303 , and the first encapsulation layer 305 exposes the top surface of the first metal feeder post 303 ;

[0154] The second antenna layer 307 is formed on the first encapsu...

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Abstract

The invention provides an antenna packaging structure and a packaging method. The packaging method comprises the steps of providing a supporting substrate, forming a rewiring layer, a first antenna layer, a first metal feed line column, a first packaging layer, a second antenna layer, a second metal feed line column, a second packaging layer and a third antenna layer, providing a semiconductor chip, and enabling the semiconductor chip to be connected to the surface of the rewiring layer, and forming a box dam dispensing protection layer at least on the top and the periphery of the semiconductor chip. The multi-layer antenna structure is formed by the multiple layers of metal feed line columns and the multiple packaging layers, the packaging size is reduced, the signal receiving capacity is enhanced, the signal receiving bandwidth is expanded, the box dam dispensing process is added for wafer-level packaging, the stability of the chip is improved, the bottom filling layer is further formed through the bottom filling process, dual protection is conducted on the chip, the packaging process flow can be effectively reduced, and the process period is improved; and the semiconductor chip, the rewiring layer, the antenna metal and other structures are arranged to be of a vertical arrangement structure, so that the conduction path between the components can be effectively shortened.

Description

technical field [0001] The invention belongs to the field of packaging and the field of communication equipment, and in particular relates to an antenna packaging structure and a packaging method. Background technique [0002] Due to the progress of science and technology, various high-tech electronic products have been developed to facilitate people's life, including various electronic devices, such as notebook computers, mobile phones, tablet computers (PADs), and the like. [0003] With the popularization of these high-tech electronic products and the increase of people's demand, in addition to the substantial increase of various functions and applications configured in these high-tech products, especially in order to meet people's mobile needs, the function of wireless communication has been added. Therefore, people can use these high-tech electronic products at any place or at any time through these high-tech electronic devices with wireless communication functions. Th...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L21/60H01L23/485H01L23/31H01L25/18H01Q1/22H01Q1/38H01Q1/50
CPCH01Q1/2283H01Q1/38H01Q1/50H01L25/18H01L23/3107H01L24/02H01L24/03H01L21/56H01L2224/02331H01L2224/02381H01L2224/02379H01L2224/031H01L2224/0231
Inventor 黄晗林正忠吴政达陈彦亨
Owner SJ SEMICON JIANGYIN CORP
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