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Fan-out package with antenna and preparation method thereof

An antenna and encapsulation layer technology, which is applied in the field of fan-out packaging with antennas and its preparation, can solve problems such as peeling and falling off, unstable antenna structure, etc., and achieve the effects of improving functionality, avoiding peeling and falling off, and improving bonding tightness

Active Publication Date: 2022-03-18
WEIHAI IDEACODS ELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the preparation process of the existing fan-out packaging structure with antennas, it is usually necessary to directly arrange a semiconductor chip on the circuit substrate. Conventionally, the semiconductor chip is connected to the semiconductor chip through a wire bonding process or a flip chip process. The circuit substrate is electrically connected, and then a plastic sealing resin layer is set on the semiconductor chip, and an antenna structure is further set on the plastic sealing resin layer. The above preparation process is likely to cause the antenna structure to be unstable, and then it is easy to peel off and fall off.

Method used

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  • Fan-out package with antenna and preparation method thereof
  • Fan-out package with antenna and preparation method thereof
  • Fan-out package with antenna and preparation method thereof

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Embodiment Construction

[0035] In order to better understand the technical solutions of the present invention, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0036] The present invention proposes a preparation method of a fan-out package with an antenna, the preparation method comprising the following steps:

[0037] A temporary carrier substrate is provided, and a temporary bonding layer is arranged on the temporary carrier.

[0038] A first inorganic sacrificial material layer is formed on the temporary bonding layer, and then a first flexible resin encapsulation layer is formed on the first inorganic sacrificial material layer.

[0039] Then remove a part of the first flexible resin encapsulation layer to form a f...

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Abstract

The invention relates to a fan-out package with an antenna and a preparation method thereof, and relates to the field of semiconductor package. The first antenna structure and the second antenna structure are formed in the first preset antenna pattern and the second preset antenna pattern in a mode of spin-coating the metal nanowire solution, and the implementation of the preparation process is convenient for improving the bonding tightness of the antenna structures and the flexible resin packaging layer, so that the antenna structures can be prevented from stripping and falling off. Furthermore, the first antenna structure and the second antenna structure are stacked and electrically connected with each other, so that the signal transmitting strength of the antenna structure or the signal receiving capability of the antenna structure is effectively improved, and the functionality of fan-out packaging is improved.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a fan-out package with an antenna and a preparation method thereof. Background technique [0002] In the preparation process of the existing fan-out packaging structure with antennas, it is usually necessary to directly arrange a semiconductor chip on the circuit substrate. Conventionally, the semiconductor chip is connected to the semiconductor chip through a wire bonding process or a flip chip process. The circuit substrate is electrically connected, and then a plastic sealing resin layer is set on the semiconductor chip, and an antenna structure is further set on the plastic sealing resin layer. The above preparation process is likely to cause the antenna structure to be unstable, and then easy to peel off and fall off. Contents of the invention [0003] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art, and provide a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/22H01Q1/38H01L23/66
CPCH01Q1/2283H01Q1/38H01L23/66
Inventor 房淑伟李华文丛石
Owner WEIHAI IDEACODS ELECTRONICS TECH CO LTD
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