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A swing leveling mechanism and leveling system

A leveling mechanism and swing-driven technology, which is applied in the direction of thin material handling, spreading thin soft materials, transportation and packaging, etc. It can solve the problems of high requirements, inability to accurately level flexible materials, and damage to the surface of flexible materials. , to achieve the effect of improving the leveling accuracy

Active Publication Date: 2021-11-12
SHANGHAI PRECISION MEASUREMENT SEMICON TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] For the leveling of flexible materials, a leveling system is usually used. The leveling system in the prior art usually has two forms: (1) the leveling system includes a carrier platform and a smoothing component. The flexible material is placed on the carrier platform, and then The smoothing component is used to roll the flexible material, so as to realize the leveling operation of the flexible material on the carrier, but this method has higher requirements on the surface shape of the upper surface of the carrier and the lower surface of the smoothing component, and the difference between the two The requirements for parallelism between them are also high, which can easily cause damage to flexible materials. In addition, this method has high requirements for the surrounding environment of the leveling system. There must be no particles between the carrier platform and the smoothing components, which will cause Damage to the surface of the flexible material; (2) The leveling system includes a stage and a stretching assembly arranged along the circumference of the stage. The flexible material is placed on the stage, and then the stretching assembly is used to straighten the flexible material. The method cannot accurately level the flexible material. When the structure of the flexible material is more complicated, the control is more difficult and the cost is higher.

Method used

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  • A swing leveling mechanism and leveling system
  • A swing leveling mechanism and leveling system
  • A swing leveling mechanism and leveling system

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Embodiment 1

[0052] Such as figure 1 As shown, this embodiment provides a leveling system, the leveling system includes a carrier 300, and the carrier 300 is used to carry a workpiece. In this embodiment, the workpiece specifically refers to a flexible material. The existing leveling system cannot adapt to the change of the surface shape of the flexible material in the process of leveling the flexible material. The stretching components arranged along the circumferential direction of the flexible material can only hold the flexible material and move in one direction. The leveling accuracy is low.

[0053] In order to solve the above problems, the leveling system of this embodiment further includes a swing leveling mechanism 100 for leveling the workpiece and improving the leveling accuracy of flexible materials.

[0054] Specifically, such as Figure 2-Figure 3 As shown, the swing leveling mechanism 100 includes a mounting base 4, a swing clamping assembly 1, a swinging assembly 2 and a sw...

Embodiment 2

[0076] like Figure 4 As shown, this embodiment provides a leveling system, the difference between the leveling system and the first embodiment is that the leveling system also includes an auxiliary leveling mechanism 200, and the auxiliary leveling mechanism 200 is set at the initial clamping position of the workpiece Nearby, the total number of auxiliary clamping mechanisms 200 and the number of swing leveling mechanisms 100 may be four, but not limited thereto, for the auxiliary group to clamp the workpiece. The swing leveling mechanism 100 and the auxiliary leveling mechanism 200 are arranged around the stage 300. The auxiliary leveling mechanism 200 can provide clamping force on at least one side of the workpiece. The auxiliary group clamping mechanism 200 can be arranged along the diagonal, when When arranged diagonally, the clamping force provided by the auxiliary group clamping mechanism 200 has clamping force components on both adjacent sides of the workpiece. For ex...

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Abstract

The invention relates to the technical field of flexible material loading, and specifically discloses a swing leveling mechanism and a leveling system. The swing leveling mechanism includes a mounting base, a swing clamping assembly, a swinging assembly and a swinging drive assembly. The swinging clamping assembly can clamp a workpiece, and the swinging clamping assembly can be suspended above the mounting base. The swinging assembly includes limit blocks and The ball head rod is provided with a ball socket inside the limit block. The ball head rod includes a ball head and a connecting rod part connected to each other. The ball head is arranged in the ball socket. The connecting rod part is connected with the swing clamping assembly. The swing driving component is arranged on the installation base and is configured to drive the swing clamping component and the swing component to move, and drive the workpiece to move. The invention provides a swing leveling mechanism, which can adapt to the change of the surface shape of the flexible material, thereby improving the leveling accuracy of the flexible material.

Description

technical field [0001] The invention relates to the technical field of flexible material loading, in particular to a swing leveling mechanism and a leveling system. Background technique [0002] For the leveling of flexible materials, a leveling system is usually used. The leveling system in the prior art usually has two forms: (1) the leveling system includes a platform and a smoothing component, and the flexible material is placed on the platform, and then The smoothing component is used to roll the flexible material, so as to realize the leveling operation of the flexible material on the carrier, but this method has higher requirements on the surface shape of the upper surface of the carrier and the lower surface of the smoothing component, and the difference between the two The requirements for parallelism between them are also high, which can easily cause damage to flexible materials. In addition, this method also has high requirements for the surrounding environment of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65H47/00
CPCB65H47/00
Inventor 李生强程亚飞王理华
Owner SHANGHAI PRECISION MEASUREMENT SEMICON TECH INC