Heat dissipating fin pasting device for mobile phone assembly

Abstract

The invention discloses a heat dissipating fin pasting device for mobile phone assembly, and belongs to the field of the mobile phone assembly. The heat dissipating fin pasting device for the mobile phone assembly comprises a module fixing plate, wherein a plurality of positioning grooves for fixing TP modules are formed in the module fixing plate; a fin pasting assembly is arranged above each TPmodule on each positioning groove; each fin pasting assembly is slidably connected with the corresponding positioning groove and comprises a film tearing scraper and a pressing roller; each film tearing scraper is positioned on the front side of the sliding direction of each fin pasting assembly when the fin pasting assembly works; and each pressing roller abuts against each TP module and tends tomove towards the TP module all the time. When the fin pasting assemblies are pushed to slide, original protective film can be conveniently torn off through the film tearing scrapers, and heat dissipating fins can be pasted and assembled at the same time through auxiliary positioning of the fin pasting assemblies and pressing effects of the pressing rollers on the heat dissipating fins, so that the operation is convenient and rapid, and the processing efficiency is improved.

Description

technical field [0001] The invention relates to the field of mobile phone assembly, in particular to a heat sink pasting device for mobile phone assembly. Background technique [0002] In the mobile phone assembly, after the TP module is installed, it is necessary to paste the graphene patch for heat dissipation, mainly in the battery installation part, it is necessary to focus on placing the heat dissipation graphene patch, so that the heat of the mobile phone battery can be quickly conducted and dissipated. Avoid the risk of mobile phone battery overheating. [0003] At present, the installation of heat dissipation stickers is generally torn off the protective film on the TP module manually with tweezers. The tweezers are inconvenient to operate and are generally difficult to tear off; then align the position and stick the heat dissipation sticker on it, and carefully adjust the position when pasting. , thus making the whole processing process slower and affecting the pro...

AI Technical Summary

Problems solved by technology

[0003] At present, the installation of heat dissipation stickers is generally torn off the protective film on the TP module manually with tweezers. The tweezers are inconvenient to operate and are generally difficult to tear off; then align the position and stick the heat dissipation sticker on it, and carefully adjust the position when pasting. , thus making the whole processing process slower and affecting the processing efficiency

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