Unlock instant, AI-driven research and patent intelligence for your innovation.

Production method of 5G power amplifier circuit board

A production method and circuit board technology, which can be used in printed circuits, multilayer circuit manufacturing, printed circuit manufacturing, etc., and can solve problems such as the influence of the accuracy of drilled holes and holes

Pending Publication Date: 2020-08-21
广东依顿电子科技股份有限公司
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem that the accuracy of the drilled holes will be affected by the existing production process after two times of resin grinding before drilling, this application provides a production method for a 5G power amplifier circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Production method of 5G power amplifier circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] The present application will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0021] Please see attached figure 1 , the figure is a production method of a 5G power amplifier circuit board in this embodiment, which includes the following steps:

[0022] A. Material cutting, cutting the raw material board into a copper clad core board of predetermined size and shape;

[0023] B. Inner layer graphics, paste a layer of photosensitive material on the copper-clad core board, and then use negative graphic black film to expose the photosensitive material in position, so that the photosensitive material in the circuit area is cured during the exposure process, and then developed, Use developer solution to remove the photosensitive material that has not been cured by UV light to expose the copper surface under the uncured photosensitive material. After the inner layer is etched to etch the exposed non-circuit copper layer, then...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a printed circuit board, in particular to a production method of a 5G power amplifier circuit board. The method comprises the following steps: via holes penetrating through the circuit board are drilled in the circuit board after board pressing at one time through a drilling machine, and the via holes comprise a resin hole plugging hole and a non-resin hole plugging hole.Compared with the prior art, the circuit board after board pressing is drilled with the resin plug hole and the non-resin plug hole at one time by the drilling machine, then the resin plug hole is selectively drilled, only one-time alignment drilling is needed, the risk of hole position degree deviation cannot be increased, and the problem that the hole position precision is affected after resin grinding cannot occur.

Description

【Technical field】 [0001] This application relates to printed circuit boards, in particular to a production method for 5G power amplifier circuit boards. 【Background technique】 [0002] With the advent of the 5G era, it will drive the comprehensive upgrade of radio frequency amplifier components. 5G products have both a demand for replacement and a quantitative increase in power amplifier components. The trend of surface mount and miniaturization of components is becoming more and more obvious, and the density of products is also increasing, followed by the requirement for 5G power amplifier circuit boards to have higher wiring density. In order to shorten the distance between the line pad and the via hole, the pad is usually designed directly on the via hole. This manufacturing process is called POFV (PlateOver Filled Via), and the via hole is punched on the patch pad of BGA or the like. This kind of hole needs to be vacuum resin plugged, and then copper plating is carried ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/00H05K3/46H05K3/40H05K3/42
CPCH05K3/0047H05K3/4614H05K3/4038H05K3/429
Inventor 唐润光杜子良吴祖荣朱高南常光炯
Owner 广东依顿电子科技股份有限公司